SN54LVC07AFK datasheet, PDF - EEWORLD Datasheet

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SN54LVC07AFK: DescriptionLVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20; Categorylogic logic; File Size136KB，9 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN54LVC07AFK Overview

LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20

SN54LVC07AFK Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	QLCC
package instruction	QCCN,
Contacts	20
Reach Compliance Code	unknown
series	LVC/LCX/Z
JESD-30 code	S-CQCC-N20
length	8.89 mm
Logic integrated circuit type	BUFFER
Number of functions	6
Number of entries	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	OPEN-DRAIN
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
propagation delay (tpd)	3.5 ns
Certification status	Not Qualified
Maximum seat height	2.03 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm

SN54LVC07AFK Related Products

	SN54LVC07AFK	SN54LVC07AJ	SN54LVC07AW	SN74LVC07ADGV
Description	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, CERAMIC, DIP-14	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CDFP14, CERAMIC, DFP-14	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14, TVSOP-14
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	QLCC	DIP	DFP	SOIC
package instruction	QCCN,	DIP,	DFP,	TSSOP, TSSOP14,.25
Contacts	20	14	14	14
Reach Compliance Code	unknown	unknown	unknown	unknown
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	S-CQCC-N20	R-GDIP-T14	R-GDFP-F14	R-PDSO-G14
length	8.89 mm	19.56 mm	9.21 mm	4.4 mm
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER
Number of functions	6	6	6	6
Number of entries	1	1	1	1
Number of terminals	20	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	QCCN	DIP	DFP	TSSOP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	FLATPACK	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	3.5 ns	3.5 ns	3.5 ns	3.5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.03 mm	5.08 mm	2.03 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal form	NO LEAD	THROUGH-HOLE	FLAT	GULL WING
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	0.4 mm
Terminal location	QUAD	DUAL	DUAL	DUAL
width	8.89 mm	7.62 mm	6.29 mm	3.6 mm

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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