Decoder/Driver, TTL, CDFP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | OTHER DECODER/DRIVER |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| SN54S138WB | SN74S138JT | SN74S138JTB | SN74S138NTB | SN74S138NB | |
|---|---|---|---|---|---|
| Description | Decoder/Driver, TTL, CDFP16 | Decoder/Driver, TTL, CDIP16 | Decoder/Driver, TTL, CDIP16 | Decoder/Driver, TTL, PDIP16 | Decoder/Driver, S Series, Inverted Output, TTL, PDIP16, DIP-16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DFP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | AMD | - | - | AMD | AMD |
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