AM31L01ADCT datasheet, PDF - EEWORLD Datasheet

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AM31L01ADCT: DescriptionStandard SRAM, 16X4, 55ns, TTL, CDIP16; Categorystorage storage; File Size356KB，8 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM31L01ADCT Overview

Standard SRAM, 16X4, 55ns, TTL, CDIP16

AM31L01ADCT Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Maximum access time	55 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Memory IC Type	STANDARD SRAM
memory width	4
Number of terminals	16
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16X4
Output characteristics	OPEN-COLLECTOR
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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AM31L01ADCT Related Products

	AM31L01ADCT	AM31L01ADCTB	AM31L01APCTB	5962-01-032-1276	AM31L01APCT
Description	Standard SRAM, 16X4, 55ns, TTL, CDIP16	Standard SRAM, 16X4, 55ns, TTL, CDIP16	Standard SRAM, 16X4, 55ns, TTL, PDIP16	Standard SRAM, 16X4, 90ns, TTL, CDIP16,	Standard SRAM, 16X4, 55ns, TTL, PDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	AMD	AMD	AMD	AMD	AMD
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	compliant	unknow
Maximum access time	55 ns	55 ns	55 ns	90 ns	55 ns
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4
Number of terminals	16	16	16	16	16
word count	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	125 °C	70 °C
organize	16X4	16X4	16X4	16X4	16X4
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
surface mount	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
JESD-609 code	e0	e0	e0	-	e0
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)

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