FIFO, 256X9, Asynchronous, MOS, PQCC28, 0.450 X 0.450 INCH, PLASTIC, LCC-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SHARP |
| package instruction | 0.450 X 0.450 INCH, PLASTIC, LCC-28 |
| Reach Compliance Code | unknown |
| period time | 66.67 ns |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| length | 11.48 mm |
| memory density | 2304 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256X9 |
| Output characteristics | TOTEM POLE |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 4.369 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.48 mm |
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