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STRUCTURE
PRODUCT SERIES
TYPE
FEATURES
Silicon Monolithic Integrated Circuit
Single-Phase Full-Wave Motor Driver for Fan Motor
ＢＤ６９７４ＦＶ
Pre-driver compatible for external Tr
Speed controllable by DC/PWM input
PWM soft switching drive
〇ABSOLUTE
MAXIMUM RATINGS
Symbol
Limit
Parameter
Supply voltage
Vcc
20
Power dissipation
Pd
874.7＊
Operating temperature
Topr
-40 to +100
Storage temperature
Tstg
-55 to +150
High side output voltage
VOH
36
Low side output voltage
VOL
15
Low side output current
IOL
10
AL output current
IAL
10
AL output voltage
VAL
20
REF current ability
IREF
12
HB current ability
IHB
12
Input voltage(H+, H-, TH, MIN, CS, SS)
VIN
7
Junction temperature
Tjmax
150
＊Reduce
by 7.0mW/°C over Ta=25°C.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
〇OPERATING
CONDITIONS
Parameter
Operating supply voltage range
Hall input voltage range
TH input voltage range
MIN input voltage range
Unit
V
mW
°C
°C
V
V
mA
mA
V
mA
mA
V
°C
Symbol
Vcc
VH
VTH
VMIN
Limit
4.3 to 17.0
0 to Vcc-2.0
0 to 7.0
0 to REF
0 to REF
Unit
V
V
V
V
V
less than Vcc=9.0V
more than Vcc=9.0V
＊This
product is not designed for production against radioactive rays.
＊This
document may be strategic data subject to COCOM regulations.
REV. B
2/4
〇ELECTRICAL
CHARACTERISTICS (Unless otherwise specified Ta=25°C, Vcc=12V)
Limit
Symbol
Parameter
Unit
Conditions
Min.
Typ.
Max.
Circuit current
Icc
3
5
8
mA
Hall input hysteresis
VHYS
±5
±10
±15
mV
High side output current
IH
9.0
12.0
16.5
mA VOH=12V
High side output leak current
IHL
-
-
10
μA
VOH=36V
Low side output high voltage
VLH
9.3
9.5
-
V
IOL=-5mA
Low side output low voltage
VLL
-
0.5
0.7
V
IOL=5mA
Lock detection ON time
TON
0.2
0.3
0.45
s
Lock detection OFF time
TOFF
4.0
6.0
9.0
s
AL output low voltage
VALL
-
-
0.3
V
IAL=5mA
AL output leak current
IALL
-
-
10
μA
VAL=17V
OSC low voltage
VOSCL
0.8
1.0
1.2
V
OSC high voltage
VOSCH
2.3
2.5
2.7
V
OSC charge current
ICOSC
-55
-40
-25
μA
OSC discharge current
IDOSC
25
40
55
μA
VTH=VREF×0.26
Output ON duty 1
DUTY1
75
80
85
%
(H side pull up R=1kΩ,
COSC=470pF)
VTH=VREF×0.35
Output ON duty 2
DUTY2
45
50
55
%
(H side pull up R=1kΩ,
COSC=470pF)
VTH=VREF×0.44
Output ON duty 3
DUTY3
15
20
25
%
(H side pull up R=1kΩ,
COSC=470pF)
REF voltage
VREF
4.8
5.0
5.2
V
IREF=-2mA
Hall bias voltage
VHB
1.10
1.26
1.50
V
IHB=-2mA
Current limit voltage
VCL
120
150
180
mV
SS charge current
ISS
50
120
300
nA VSS=0V
TH bias current
ITH
-
-
0.2
μA
MIN bias current
IMIN
-
-
0.2
μA
CS bias current
ICS
-
-
0.2
μA
REV. B
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〇PACKAGE
OUTLINES
5.0
±
0.2
1.15
±
0.1 6.4
±
0.3
0.1
4.4
±
0.2
16
D6974
9
1
Lot No.
8
0.15
±
0.1
0.65
0.1
0.22
±
0.1
SSOP-B16 (UNIT: mm)
〇BLOCK
DIAGRAM
AL
GND
SIGNAL
OUTPUT
SOFT
START
QUICK
START
TSD
0.3Min.
〇TERMINAL
NAME
PIN No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Terminal
name
AL
OSC
MIN
TH
REF
Vcc
A1H
A1L
A2L
A2H
CS
SS
H+
HB
H-
GND
1
OSC
16
H-
2
MIN
OSC
SOFT
SWITCH
LOCK
PROTECTION
15
HB
HB
+
-
MIN
PWMCOMP
3
TH
14
H+
VCL
+
-
TH
PWMCOMP
HALL
COMP
-
+
4
REF
13
SS
CONTROL
REF
LOGIC
CURRENT
LIMIT
COMP
+
5
Vcc
+
-
12
CS
6
A1H
PRE DRIVER
11
A2H
7
A1L
10
A2L
8
9
REV. B
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〇CAUTIONS
ON USE
1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down
the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will
expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An
external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor
between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem
before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low
temperatures)
4) GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor.
The potential of GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs
terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor
output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use
condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or
if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a hysteresis width
of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always
discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig
or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when
transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single
ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents
do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external
components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the
current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below
100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied
to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual
interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic
element is actuated.
REV. B
Notice
Notes
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