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IS24C01B-3ZLA3

Description
EEPROM, 128X8, Serial, CMOS, PDSO8, 3 X 4.40 MM, GREEN, MO-153, TSSOP-8
Categorystorage    storage   
File Size452KB,24 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
Download Datasheet Parametric Compare View All

IS24C01B-3ZLA3 Overview

EEPROM, 128X8, Serial, CMOS, PDSO8, 3 X 4.40 MM, GREEN, MO-153, TSSOP-8

IS24C01B-3ZLA3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP8,.25
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum100
Durability1000000 Write/Erase Cycles
I2C control byte1010DDDR
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.4 mm
memory density1024 bit
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count128 words
character code128
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize128X8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply2/5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Serial bus typeI2C
Maximum standby current0.000001 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
width3 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
IS24C01B IS24C02B
IS24C01B/02B
2-WIRE (I C)
2
1K-bit/2K-bit
SERIAL EEPROM
Integrated Silicon Solution, Inc. — www.issi.com
Rev. D
06/27/08
1

IS24C01B-3ZLA3 Related Products

IS24C01B-3ZLA3 IS24C01B-3GLA3 IS24C02B-3ZLA3 IS24C02B-3GLA3
Description EEPROM, 128X8, Serial, CMOS, PDSO8, 3 X 4.40 MM, GREEN, MO-153, TSSOP-8 EEPROM, 128X8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, SOIC-8 EEPROM, 256X8, Serial, CMOS, PDSO8, 3 X 4.40 MM, GREEN, MO-153, TSSOP-8 EEPROM, 256X8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, SOIC-8
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code TSSOP SOIC TSSOP SOIC
package instruction TSSOP, TSSOP8,.25 SOP, SOP8,.25 TSSOP, TSSOP8,.25 SOP, SOP8,.25
Contacts 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz
Data retention time - minimum 100 100 100 100
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010DDDR 1010DDDR 1010DDDR 1010DDDR
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 e3 e3 e3
length 4.4 mm 4.9 mm 4.4 mm 4.9 mm
memory density 1024 bit 1024 bit 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 8 8 8 8
word count 128 words 128 words 256 words 256 words
character code 128 128 256 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 128X8 128X8 256X8 256X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP TSSOP SOP
Encapsulate equivalent code TSSOP8,.25 SOP8,.25 TSSOP8,.25 SOP8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 2/5 V 2/5 V 2/5 V 2/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.75 mm 1.2 mm 1.75 mm
Serial bus type I2C I2C I2C I2C
Maximum standby current 0.000001 A 0.000001 A 0.000001 A 0.000001 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 0.65 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 10 10 10 10
width 3 mm 3.9 mm 3 mm 3.9 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms
write protect HARDWARE HARDWARE HARDWARE HARDWARE
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