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Structure
Products
Type
Features
Silicon Monolithic IC
High side switch IC
BD82061FVJ
Low on resistance 70mΩ MOSFET Switch
1A Continuous current load
Active “Low” control logic
Soft start circuit
Over current detection
Thermal shutdown
Under voltage lockout
Open drain error flag output
Reverse-current protection when power switch off
TSSOP-B8J Package
ESD protection
◇Absolute
maximum ratings (Ta=25°C)
Parameter
Supply voltage
Enable voltage
/OC voltage
/OC sink current
OUT voltage
Storage temperature
Symbol
V
IN
V
/EN
V
/OC
IS
/OC
V
OUT
T
STG
Rating
-0.3 ~ 6.0
-0.3 ~ 6.0
-0.3 ~ 6.0
~ 5
-0.3 ~ 6.0
-55 ~ 150
Unit
V
V
V
mA
V
°C
mW
Power dissipation
PD
587.5
*1
*1 Mounted on 70mm*70mm*1.6mm glass-epoxy PCB. Derating : 4.7mW/°C above Ta=25°C.
＊
This product is not designed for protection against radioactive rays.
◇Operating
conditions
Parameter
Operating voltage
Operating temperature
Continuous output current
Symbol
V
IN
T
OPR
I
OUT
Min.
2.7
-40
0.0
Typ.
-
-
-
Max.
5.5
85
1.0
Unit
V
°C
A
REV. A
2/4
◇Electric
characteristics
Unless otherwise specified V
IN
= 5.0V, Ta = 25°C
Parameter
Current consumption
Operating Current
Standby Current
I/O
V
/EN
/EN input voltage
V
/EN
/EN input current
/OC output LOW voltage
/OC output leak current
/OC delay time
Power switch
ON resistance
Current Limit Threshold
Short-circuit current
Output rise time
Output rise delay time
Output fall time
Output fall delay time
Switch leak current
Reverse leak current
UVLO
UVLO
Threshold
◇Measurement
circuit
V
IN
Symbol
Min.
Typ.
Max.
Unit
Condition
I
DD
I
STB
-
-
110
0.01
160
1
μA
μA
V
/EN
= 0V, V
OUT
= Open
V
/EN
= 5V, V
OUT
= Open
2.0
-
-1.0
-
-
10
-
-
0.01
-
0.01
15
-
0.8
1.0
0.5
1
20
V
V
μA
V
μA
ms
High input
Low input
V
/EN
= 0V or 5V
I
/OC
= 0.5mA
V
/OC
= 5V
I
/EN
V
/OC
IL
/OC
T
/OC
R
ON
I
TH
I
SC
T
ON1
T
ON2
T
OFF1
T
OFF2
IL
SW
IL
REV
-
1.5
1.1
-
-
-
-
-
-
70
2.4
1.5
0.8
1.1
5
10
-
-
110
3.0
2.1
10
20
20
40
1.0
1.0
mΩ
A
A
ms
ms
μs
μs
μA
μA
I
OUT
= 500mA
V
OUT
= 0V, C
L
= 47μF
RMS
R
L
= 10Ω
R
L
= 10Ω
R
L
= 10Ω
R
L
= 10Ω
V
/EN
= 5V, V
OUT
= 0V
V
OUT
= 5.5V, V
IN
= 0V
V
TUVH
V
TUVL
2.1
2.0
2.3
2.2
2.5
2.4
V
V
Increasing V
IN
Decreasing V
IN
◇Timing
chart at output rise / fall time
T
OFF1
T
ON1
V
OUT
90%
10%
90%
10%
T
OFF2
T
ON2
A
IN
GND
V
/EN
/EN
/OC
OUT
R
L
A
C
L
I
OUT
V
/EN
50%
50%
REV. A
3/4
◇Block
diagram
GND
OUT
IN
UVLO
Charge
Pump
OCD
OUT
IN
Gate
Logic
OUT
/EN
TSD
/OC
◇Pin
description
Pin No.
1
2,3
4
5
6,7,8
Pin Name
GND
IN
/EN
/OC
OUT
Ground
Power supply input. Input terminal to the power switch and power
supply input terminal of the internal circuit.
Enable input.
Power switch on at Low level.
Over current output.
Low level at over current, over temperature detection.
Open drain output.
Power switch output.
Function
◇Package
D 8 2
0 6 1
Lot No.
TSSOP-B8J
(Unit : mm)
REV. A
4/4
●Cautions
on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention
to the interference by common impedance of layout pattern when there are plural power supplies and GND lines.
Especially, when there are GND pattern for small signal and GND pattern for large current included the external
circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the
power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between
terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of
the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then
breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to
apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In
addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power
supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
When junction temperatures become 170°C (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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