BU7625GUW datasheet, PDF - EEWORLD Datasheet

BU7625GUW: DescriptionSilicon monolithic integrated circuits; CategoryOther integrated circuit (IC) Consumption circuit; File Size497KB，7 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BU7625GUW Overview

Silicon monolithic integrated circuits

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
Parts packaging code	BGA
package instruction	VFBGA, BGA35,6X6,20
Contacts	35
Reach Compliance Code	compli
Commercial integrated circuit types	CONSUMER CIRCUIT
JESD-30 code	S-PBGA-B35
length	4 mm
Number of functions	1
Number of terminals	35
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA35,6X6,20
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	0.9 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
surface mount	YES
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4 mm

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