BU92747KV datasheet, PDF - EEWORLD Datasheet

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BU92747KV: DescriptionSilicon Monolithic Integrated Circuit; CategoryWireless rf/communication Telecom circuit; File Size415KB，5 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BU92747KV Overview

Silicon Monolithic Integrated Circuit

BU92747KV Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
Parts packaging code	QFP
package instruction	LFQFP,
Contacts	48
Reach Compliance Code	compli
JESD-30 code	S-PQFP-G48
length	7 mm
Number of functions	1
Number of terminals	48
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.625 mm
Nominal supply voltage	1.8 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm

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Structure

Product Name

Model name

Outer Dimension

Features

Silicon Monolithic Integrated Circuit

IrDA Controller LSI built-in Ir remote control

BU92747KV

Figure 1 Outer Dimensions

・Data

transfer speed (bps)

IrDA SIR: 2.4kbps, 9.6kbps, 19.2kbps, 38.4kbps, 57.6kbps and 115.2kbps

IrDA MIR: 0.576Mbps, 1.152Mbps

IrDA FIR: 4Mbps

IrSimple

・Interface

16-bit data bus , Address A

0-3

・Built-in

2560

2byte FIFO buffer (for transmission and reception)

・Accessible

as a memory device connected to the bus

・Power

down mode setting possible for transmission and reception

・Input

clock of 48MHz for external input clock and crystal input clock

・Ir

remote control function

Serial 2-lines SDA, and SCL

*This LSI chip is not subject to radiation-proof design.

●Absolute

Maximum Rating

Ta=25°C unless otherwise stated

Item

Symbol

Minimum

Maximum

2.5

4.5

IO1, 2

+0.3

900

125

Unit

°C

Supply voltage

-0.3

Interface supply voltage1

IO1

-0.3

Interface supply voltage2

IO2

-0.3

Input voltage

-0.3

Power dissipation

Operating temperature range

OPR

-40

Storage temperature range

STG

-55

*1 It applies to all pins based on the GND pin.

*2 Reduced by 9.0mW for each increase in Ta of 1℃ over 25℃

(mounted on 70.0mm

70.0mm

1.6mm Glass-epoxy PCB)

●Operation

Range

Item

Symbol

Minimum

Standard

Supply voltage

1.62

1.8

Interface supply voltage1

IO1

1.62

1.8

Interface supply voltage2

IO2

1.62

1.8

*3 V

IO2

is connected with XIN/CLK48M, XOUT, PWDN, NIRQ and RESET.

Maximum

1.98

3.6

Unit

Status of this document

The Japanese version of this document is the formal specification.

A customer may use this translation version only for a reference to help reading the formal version.

If there are any differences in translation version of this document, formal version takes priority.

REV. A

4/4

●Notes

for use

(1) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range

may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open

mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when

use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.

(2) Mutual impedance

Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance

as small as possible .Use a capacitor to keep ripple to a minimum.

(3) GND potential

Ensure a minimum GND pin potential in all operating conditions.

(4) Short circuit mode between terminals and wrong mounting

In order to mount the IC on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous

mounting can destroy the IC. Furthermore, if a short circuit occurs due to foreign matters entering between

terminals or between the terminal and the power supply or the GND terminal, the IC can destroy

(5) Setting of heat

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

(6) Actions in strong magnetic field

Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to

malfunction.

(7) Ground Wiring Pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground

patterns, placing a single ground point at the application's reference point so that the pattern wiring

resistance and voltage variations caused by large currents do not cause variations in the small signal ground

voltage. Be careful not to change the GND wiring pattern of any external components, either.

(8) When power is first supplied the CMOS IC, it is possible that the internal logic may be unstable and rush current

may flow instantaneously.

Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and

routing of connections.

(9) For ICs with more than one power, it is possible than rush current many flow instantaneously due to the internal

powering sequence and delays.

Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and

routing of wiring.

REV. A

Appendix

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM

CO.,LTD.

The content specified herein is subject to change for improvement without notice.

The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you

wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM

upon request.

Examples of application circuits, circuit constants and any other information contained herein illustrate the

standard usage and operations of the Products. The peripheral conditions must be taken into account when

designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specified in this document. However, should

you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no respon-

sibility for such damage.

The technical information specified herein is intended only to show the typical functions of and examples of

application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or

exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility

whatsoever for any dispute arising from the use of such technical information.

The Products specified in this document are intended to be used with general-use electronic equipment or

devices (such as audio visual equipment, office-automation equipment, communication devices, electronic

appliances and amusement devices).

The Products are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or

malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard against the

possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as

derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your

use of any Product outside of the prescribed scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or system

which requires an extremely high level of reliability the failure or malfunction of which may result in a direct

threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment,

aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no

responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended

to be used for any such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specified herein that may be controlled under

the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact your nearest sales office.

ROHM

Customer Support System

www.rohm.com

2008 ROHM CO.,LTD.

THE AMERICAS

EUROPE

ASIA

JAPAN

webmaster@ rohm.co. jp

21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan

TEL : +81-75-311-2121

FAX : +81-75-315-0172

Appendix1-Rev3.0

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