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MBM27C1024-20Z

Description
UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERDIP-40
Categorystorage    storage   
File Size290KB,12 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MBM27C1024-20Z Overview

UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERDIP-40

MBM27C1024-20Z Parametric

Parameter NameAttribute value
Objectid1400472612
package instructionWDIP,
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
JESD-30 codeR-GDIP-T40
length52.07 mm
memory density1048576 bit
Memory IC TypeUVPROM
memory width16
Number of functions1
Number of terminals40
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX16
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.84 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

MBM27C1024-20Z Related Products

MBM27C1024-20Z MBM27C1024-25Z MBM27C1024-20TV MBM27C1024-15TV MBM27C1024-15Z
Description UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERDIP-40 UVPROM, 64KX16, 250ns, CMOS, CDIP40, CERDIP-40 UVPROM, 64KX16, 200ns, CMOS, CQCC44, FRIT SEALED, CERAMIC, LCC-44 EPROM, 64KX16, 150ns, CMOS, CQCC44 UVPROM, 64KX16, 150ns, CMOS, CDIP40, CERDIP-40
package instruction WDIP, WDIP, WQCCN, QCCN, LCC44,.65SQ WDIP,
Reach Compliance Code unknown unknown unknown unknow unknown
Maximum access time 200 ns 250 ns 200 ns 150 ns 150 ns
JESD-30 code R-GDIP-T40 R-GDIP-T40 S-CQCC-N44 S-XQCC-N44 R-GDIP-T40
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bi 1048576 bit
memory width 16 16 16 16 16
Number of terminals 40 40 44 44 40
word count 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64KX16 64KX16 64KX16 64KX16 64KX16
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC CERAMIC, GLASS-SEALED
encapsulated code WDIP WDIP WQCCN QCCN WDIP
Package shape RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR
Package form IN-LINE, WINDOW IN-LINE, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER IN-LINE, WINDOW
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL QUAD QUAD DUAL
Objectid 1400472612 1400472614 1400472611 - 1400472634
ECCN code EAR99 EAR99 EAR99 - EAR99
length 52.07 mm 52.07 mm 16.51 mm - 52.07 mm
Memory IC Type UVPROM UVPROM UVPROM - UVPROM
Number of functions 1 1 1 - 1
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
Parallel/Serial PARALLEL PARALLEL PARALLEL - PARALLEL
Maximum seat height 5.84 mm 5.84 mm 3.3 mm - 5.84 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V - 4.5 V
width 15.24 mm 15.24 mm 16.51 mm - 15.24 mm
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