EPROM, 64KX16, 150ns, CMOS, CQCC44
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | FUJITSU |
| Parts packaging code | LCC |
| package instruction | QCCN, LCC44,.65SQ |
| Contacts | 44 |
| Reach Compliance Code | unknow |
| Maximum access time | 150 ns |
| I/O type | COMMON |
| JESD-30 code | S-XQCC-N44 |
| JESD-609 code | e0 |
| memory density | 1048576 bi |
| memory width | 16 |
| Number of terminals | 44 |
| word count | 65536 words |
| character code | 64000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX16 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC44,.65SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.04 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| MBM27C1024-15TV | MBM27C1024-25Z | MBM27C1024-20TV | MBM27C1024-20Z | MBM27C1024-15Z | |
|---|---|---|---|---|---|
| Description | EPROM, 64KX16, 150ns, CMOS, CQCC44 | UVPROM, 64KX16, 250ns, CMOS, CDIP40, CERDIP-40 | UVPROM, 64KX16, 200ns, CMOS, CQCC44, FRIT SEALED, CERAMIC, LCC-44 | UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERDIP-40 | UVPROM, 64KX16, 150ns, CMOS, CDIP40, CERDIP-40 |
| package instruction | QCCN, LCC44,.65SQ | WDIP, | WQCCN, | WDIP, | WDIP, |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
| Maximum access time | 150 ns | 250 ns | 200 ns | 200 ns | 150 ns |
| JESD-30 code | S-XQCC-N44 | R-GDIP-T40 | S-CQCC-N44 | R-GDIP-T40 | R-GDIP-T40 |
| memory density | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| memory width | 16 | 16 | 16 | 16 | 16 |
| Number of terminals | 44 | 40 | 44 | 40 | 40 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 | 64000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| Package body material | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | WDIP | WQCCN | WDIP | WDIP |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL | DUAL |
| Objectid | - | 1400472614 | 1400472611 | 1400472612 | 1400472634 |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 |
| length | - | 52.07 mm | 16.51 mm | 52.07 mm | 52.07 mm |
| Memory IC Type | - | UVPROM | UVPROM | UVPROM | UVPROM |
| Number of functions | - | 1 | 1 | 1 | 1 |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Maximum seat height | - | 5.84 mm | 3.3 mm | 5.84 mm | 5.84 mm |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| width | - | 15.24 mm | 16.51 mm | 15.24 mm | 15.24 mm |
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