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K9K1G16U0A-PIB00

Description
Flash, 16MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Categorystorage    storage   
File Size922KB,44 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K9K1G16U0A-PIB00 Overview

Flash, 16MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48

K9K1G16U0A-PIB00 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeTSOP1
package instruction12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time30 ns
Other featuresCONTAINS ADDITIONAL 32M BIT NAND FLASH
JESD-30 codeR-PDSO-G48
length18.4 mm
memory density268435456 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count16777216 words
character code16000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
typeSLC NAND TYPE
width12 mm
K9K1G08Q0A
K9K1G08U0A K9K1G16U0A
Preliminary
FLASH MEMORY
Document Title
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
Revision History
Revision No. History
0.0
0.1
Initial issue.
1. Note is added.
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for
durations of 20 ns or less.)
2. 63FBGA,1.8V product is added.
K9K1G08Q0A-GCB0,GIB0,JCB0,JIB0
Errata is deleted.
AC parameters are changed.
Before
After
0.3
tWC tWH tWP tRC tREH tRP tREA tCEA
45 15 25 50 15 25 30
45
60 20 40 60 20 40 40
55
Oct. 14th 2003
Preliminary
Draft Date
Mar. 17th 2003
Jun. 4th 2003
Remark
Advance
Preliminary
Aug. 1st 2003
0.2
Preliminary
1. K9K1G16Q0A-DC(I)B0 is deleted.
2. AC parameters are changed.
K9K1GXXU0A
K9K1GXXD0A
K9K1G08Q0A
tWC tWH tWP tRC tREH tRP tREA tCEA
50 15 25 50 15 25 30
45
60
20
40
60
20
40
40
55
0.4
0.5
1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.
1. PKG(TSOP1, WSOP1) Dimension Change
Apr. 23th 2004
May 21th 2004
Preliminary
Preliminary
Note : For more detailed features and specifications including FAQ, please refer to Samsung’ Flash web site.
s
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you
have any questions, please contact the SAMSUNG branch office near your office.
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