|
IDT7034SPFI |
IDT7034LPFI |
| Description |
Dual-Port SRAM, 4KX18, CMOS, PQFP100, TQFP-100 |
Dual-Port SRAM, 4KX18, CMOS, PQFP100, TQFP-100 |
| Is it lead-free? |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| Parts packaging code |
QFP |
QFP |
| package instruction |
LFQFP, |
LFQFP, |
| Contacts |
100 |
100 |
| Reach Compliance Code |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
| JESD-30 code |
S-PQFP-G100 |
S-PQFP-G100 |
| JESD-609 code |
e0 |
e0 |
| length |
14 mm |
14 mm |
| memory density |
73728 bit |
73728 bit |
| Memory IC Type |
DUAL-PORT SRAM |
DUAL-PORT SRAM |
| memory width |
18 |
18 |
| Humidity sensitivity level |
3 |
3 |
| Number of functions |
1 |
1 |
| Number of terminals |
100 |
100 |
| word count |
4096 words |
4096 words |
| character code |
4000 |
4000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| organize |
4KX18 |
4KX18 |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFQFP |
LFQFP |
| Package shape |
SQUARE |
SQUARE |
| Package form |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
| Parallel/Serial |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
240 |
240 |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.6 mm |
1.6 mm |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
GULL WING |
| Terminal pitch |
0.5 mm |
0.5 mm |
| Terminal location |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
20 |
20 |
| width |
14 mm |
14 mm |