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IDT707288L25PF

Description
Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100
Categorystorage    storage   
File Size66KB,6 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT707288L25PF Overview

Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100

IDT707288L25PF Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instruction14 X 14 MM, 1.40 MM, TQFP-100
Contacts100
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time25 ns
Other featuresAUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG
I/O typeCOMMON
JESD-30 codeS-PQFP-G100
JESD-609 codee0
length14 mm
memory density1048576 bit
Memory IC TypeDUAL-PORT SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of ports2
Number of terminals100
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX16
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP100,.63SQ,20
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.005 A
Minimum standby current4.5 V
Maximum slew rate0.28 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
Integrated Device Technology, Inc.
HIGH-SPEED
64K x 16 BANK-SWITCHABLE
DUAL-PORTED SRAM WITH
EXTERNAL BANK SELECTS
DESCRIPTION:
ADVANCED
IDT707288S/L
FEATURES:
• 64K x 16 Bank-Switchable Dual-Ported SRAM Architecture
- Four independent 16K x 16 banks
- 1 Megabit of memory on chip
• Fast asynchronous address-to-data access time: 20ns
• User-controlled input pins included for bank selects
• Independent port controls with asynchronous address &
data busses
• Four 16-bit mailboxes available to each port for inter-
processor communications; interrupt option
• Interrupt flags with programmable masking
• Dual Chip Enables allow for depth expansion without
external logic
UB
and
LB
are available for bus matching to x8 or x16
busses; also support very fast banking
• TTL-compatible, single 5V (±10%) power supply
• Available in a 100-pin Thin Quad Plastic Flatpack (TQFP)
and a 108-pin ceramic Pin Grid Array (PGA)
The IDT707288 is a high-speed 64K x 16 (1M bit) Bank-
Switchable Dual-Ported SRAM organized into four indepen-
dent 16K x 16 banks. The device has two independent ports
with separate controls, addresses, and I/O pins for each port,
allowing each port to asynchronously access any 16K x 16
memory block not already accessed by the other port. Ac-
cesses by the ports into specific banks are controlled via bank
select pin inputs under the user's control. Mailboxes are
provided to allow inter-processor communications. Interrupts
are provided to indicate mailbox writes have occurred. An
automatic power down feature controlled by the chip enables
(
CE
0
and CE
1
) permits the on-chip circuitry of each port to
enter a very low standby power mode and allows fast depth
expansion.
The IDT707288 offers a maximum address-to-data access
time as fast as 20ns, while typically operating on only 900mW
of power, and is available in a 100-pin Thin Quad Plastic
Flatpack (TQFP) and a 108-pin ceramic Pin Grid Array (PGA).
R/
FUNCTIONAL BLOCK DIAGRAM
R/
L
0L
CE
1L
L
L
L
MUX
R
CONTROL
LOGIC
16Kx16
MEMORY
ARRAY
(BANK 0)
MUX
CONTROL
LOGIC
0R
CE
1R
R
R
R
I/O
8L-15L
I/O
0L-7L
I/O
CONTROL
MUX
16Kx16
MEMORY
ARRAY
(BANK 1)
MUX
I/O
CONTROL
I/O
8R-15R
I/O
0R-7R
A
13L
A
0L(1)
ADDRESS
DECODE
ADDRESS
DECODE
A
13R
A
0R(1)
BA
1L
BA
0L
BANK
DECODE
MUX
16Kx16
MEMORY
ARRAY
(BANK 3)
MUX
BANK
DECODE
BA
1R
BA
0R
BKSEL
3(2)
BKSEL
0(2)
BANK
SELECT
A
5L(1)
A
0L(1)
L
/
L
L
MAILBOX
INTERRUPT
LOGIC
A
5R(1)
A
0R(1)
R
/
R
R
R/
L
L
L
L
R/
R
R
R
R
3592 drw 01
NOTES:
1. The first six address pins for each port serve dual functions. When
MBSEL
= V
IH
, the pins serve as memory address inputs. When
MBSEL
= V
IL
, the pins
serve as mailbox address inputs.
2. Each bank has an input pin assigned that allows the user to toggle the assignment of that bank between the two ports. Refer to Table I for more details.
The IDT logo is a registered trademark of Integrated Device Technology
COMMERCIAL TEMPERATURE RANGE
©1996 Integrated Device Technology, Inc.
For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
OCTOBER 1996
DSC-3592/-
6.29
1

IDT707288L25PF Related Products

IDT707288L25PF IDT707288L20PF IDT707288S25PF
Description Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100 Dual-Port SRAM, 64KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100 Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM, TQFP-100
Is it Rohs certified? incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFP QFP QFP
package instruction 14 X 14 MM, 1.40 MM, TQFP-100 14 X 14 MM, 1.40 MM, TQFP-100 14 X 14 MM, 1.40 MM, TQFP-100
Contacts 100 100 100
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN code EAR99 3A991.B.2.B EAR99
Maximum access time 25 ns 20 ns 25 ns
Other features AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; INTERRUPT FLAG
I/O type COMMON COMMON COMMON
JESD-30 code S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
JESD-609 code e0 e0 e0
length 14 mm 14 mm 14 mm
memory density 1048576 bit 1048576 bit 1048576 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 16 16 16
Humidity sensitivity level 3 3 3
Number of functions 1 1 1
Number of ports 2 2 2
Number of terminals 100 100 100
word count 65536 words 65536 words 65536 words
character code 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 64KX16 64KX16 64KX16
Output characteristics 3-STATE 3-STATE 3-STATE
Exportable YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP QFP
Encapsulate equivalent code QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20
Package shape SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm
Maximum standby current 0.005 A 0.005 A 0.015 A
Minimum standby current 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.28 mA 0.29 mA 0.33 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD
Maximum time at peak reflow temperature 20 20 20
width 14 mm 14 mm 14 mm
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