Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | QFP |
| package instruction | TQFP-80 |
| Contacts | 80 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 45 ns |
| Other features | AUTOMATIC POWER-DOWN |
| JESD-30 code | S-PQFP-G80 |
| JESD-609 code | e3 |
| length | 14 mm |
| memory density | 131072 bit |
| Memory IC Type | MULTI-PORT SRAM |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 80 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX16 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | MATTE TIN |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 14 mm |
| IDT70825S45PFG8 | IDT70825S45PF8 | IDT70825L45PFG8 | IDT70825L45PF8 | |
|---|---|---|---|---|
| Description | Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80 | Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80 | Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80 | Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80 |
| Is it lead-free? | Lead free | Contains lead | Lead free | Contains lead |
| Is it Rohs certified? | conform to | incompatible | conform to | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | QFP | QFP | QFP | QFP |
| package instruction | TQFP-80 | TQFP-80 | TQFP-80 | TQFP-80 |
| Contacts | 80 | 80 | 80 | 80 |
| Reach Compliance Code | compliant | not_compliant | compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 45 ns | 45 ns | 45 ns | 45 ns |
| Other features | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN |
| JESD-30 code | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 |
| JESD-609 code | e3 | e0 | e3 | e0 |
| length | 14 mm | 14 mm | 14 mm | 14 mm |
| memory density | 131072 bit | 131072 bit | 131072 bit | 131072 bit |
| Memory IC Type | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
| memory width | 16 | 16 | 16 | 16 |
| Humidity sensitivity level | 3 | 3 | 3 | 3 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 | 2 |
| Number of terminals | 80 | 80 | 80 | 80 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 8KX16 | 8KX16 | 8KX16 | 8KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LQFP | LQFP | LQFP | LQFP |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 | 240 | 260 | 240 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | MATTE TIN | TIN LEAD | MATTE TIN | TIN LEAD |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 30 | 20 | 30 | 20 |
| width | 14 mm | 14 mm | 14 mm | 14 mm |
京公网安备 11010802033920号
EEWORLD
