IDT70825L45PFG8 datasheet, PDF

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IDT70825L45PFG8: DescriptionMulti-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80; Categorystorage storage; File Size697KB，21 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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IDT70825L45PFG8 Overview

Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80

IDT70825L45PFG8 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	QFP
package instruction	TQFP-80
Contacts	80
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	45 ns
Other features	AUTOMATIC POWER-DOWN
JESD-30 code	S-PQFP-G80
JESD-609 code	e3
length	14 mm
memory density	131072 bit
Memory IC Type	MULTI-PORT SRAM
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	80
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX16
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.6 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm

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IDT70825L45PFG8 Related Products

	IDT70825L45PFG8	IDT70825S45PF8	IDT70825S45PFG8	IDT70825L45PF8
Description	Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80	Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80	Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80	Multi-Port SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80
Is it lead-free?	Lead free	Contains lead	Lead free	Contains lead
Is it Rohs certified?	conform to	incompatible	conform to	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	QFP	QFP	QFP	QFP
package instruction	TQFP-80	TQFP-80	TQFP-80	TQFP-80
Contacts	80	80	80	80
Reach Compliance Code	compliant	not_compliant	compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	45 ns	45 ns	45 ns	45 ns
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
JESD-30 code	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80
JESD-609 code	e3	e0	e3	e0
length	14 mm	14 mm	14 mm	14 mm
memory density	131072 bit	131072 bit	131072 bit	131072 bit
Memory IC Type	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
memory width	16	16	16	16
Humidity sensitivity level	3	3	3	3
Number of functions	1	1	1	1
Number of ports	2	2	2	2
Number of terminals	80	80	80	80
word count	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	8KX16	8KX16	8KX16	8KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	240	260	240
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	MATTE TIN	TIN LEAD	MATTE TIN	TIN LEAD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	20	30	20
width	14 mm	14 mm	14 mm	14 mm

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