IDT71024S25LBG8 datasheet, PDF

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IDT71024S25LBG8: DescriptionStandard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32; Categorystorage storage; File Size184KB，8 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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IDT71024S25LBG8 Overview

Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32

IDT71024S25LBG8 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	DLCC
package instruction	SON,
Contacts	32
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	25 ns
JESD-30 code	R-CDSO-N32
JESD-609 code	e3
length	20.828 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	2.54 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	10.16 mm

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Description	Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32	Standard SRAM, 128KX8, 17ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32	Standard SRAM, 128KX8, 17ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32	Standard SRAM, 128KX8, 17ns, CMOS, PDSO32, 0.300 INCH, SOJ-32	Standard SRAM, 128KX8, 17ns, CMOS, PDSO32, 0.400 INCH, SOJ-32	Standard SRAM, 128KX8, 20ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32	Standard SRAM, 128KX8, 20ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32	Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32	Standard SRAM, 128KX8, 15ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32	Standard SRAM, 128KX8, 15ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32
Is it lead-free?	Lead free	Lead free	Contains lead	Contains lead	Contains lead	Lead free	Contains lead	Contains lead	Lead free	Contains lead
Is it Rohs certified?	conform to	conform to	incompatible	incompatible	incompatible	conform to	incompatible	incompatible	conform to	incompatible
Parts packaging code	DLCC	DLCC	DLCC	SOJ	SOJ	DLCC	DLCC	DLCC	DLCC	DLCC
package instruction	SON,	SON,	SON,	SOJ,	SOJ,	SON,	SON,	SON,	SON,	SON,
Contacts	32	32	32	32	32	32	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A991.B.2.B	3A991.B.2.B	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	25 ns	17 ns	17 ns	17 ns	17 ns	20 ns	20 ns	25 ns	15 ns	15 ns
JESD-30 code	R-CDSO-N32	R-CDSO-N32	R-CDSO-N32	R-PDSO-J32	R-PDSO-J32	R-CDSO-N32	R-CDSO-N32	R-CDSO-N32	R-CDSO-N32	R-CDSO-N32
JESD-609 code	e3	e3	e0	e0	e0	e3	e0	e0	e3	e0
length	20.828 mm	20.828 mm	20.828 mm	20.955 mm	20.955 mm	20.828 mm	20.828 mm	20.828 mm	20.828 mm	20.828 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SON	SON	SON	SOJ	SOJ	SON	SON	SON	SON	SON
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	225	225	225	260	225	225	260	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.54 mm	2.54 mm	2.54 mm	3.76 mm	3.683 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN LEAD	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	NO LEAD	J BEND	J BEND	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30	30	30
width	10.16 mm	10.16 mm	10.16 mm	7.62 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm
Maker	IDT (Integrated Device Technology)	-	-	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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