CMX969P4 datasheet, PDF - EEWORLD Datasheet

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CMX969P4: DescriptionModem-Support Circuit, 19.2kbps Data, CMOS, PDIP24, DIP-24; CategoryWireless rf/communication Telecom circuit; File Size903KB，37 Pages; ManufacturerCML Microcircuits; Websitehttp://www.cmlmicro.com/

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CMX969P4 Overview

Modem-Support Circuit, 19.2kbps Data, CMOS, PDIP24, DIP-24

CMX969P4 Parametric

Parameter Name	Attribute value
Maker	CML Microcircuits
Parts packaging code	DIP
package instruction	DIP, DIP24,.6
Contacts	24
Reach Compliance Code	compliant
data rate	19.2 Mbps
JESD-30 code	R-PDIP-T24
length	31.37 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	3.3/5 V
Certification status	Not Qualified
Maximum seat height	5.59 mm
Maximum slew rate	0.009 mA
Nominal supply voltage	3.3 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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CMX969

RD-LAP/MDC4800

Motient/

ARDIS

D/969/5

April 2001

Provisional Information

Features

•

Applications

•

Autonomous Frame Sync Detection

for SFR operation

Full Packet Data Framing

Low Power, 3.0 to 5.5V operation

Powersave Option

DataTAC*, Motient/ARDIS*, Dual

Mode RD-LAP* and MDC 4800

Two-Way Paging Equipment

Mobile Data Systems

Wireless Telemetry

DataTAC Terminals

*Radio Data-Link Access Procedure (RD-LAP) is a data communications air interface protocol developed by Motorola Inc.

*Motient is a registered service mark of the Motient Company operating the Motient Network. (Formerly known as American Mobile

operating the ARDIS Network).

*DataTAC is a registered trademark of Motorola Inc.

1.1

Brief Description

The CMX969 is a CMOS integrated circuit that contains all of the baseband signal processing and Medium

Access Control (MAC) protocol functions required for a high performance DataTAC dual mode (RD-LAP

19200 bps and MDC 4800 bps) FSK Wireless Packet Data Modem suitable for use with the Motient/ARDIS

network. It interfaces with the modem host processor and the radio modulation/demodulation circuits to

deliver reliable two-way transfer of the application data over the wireless link.

The CMX969 assembles application data received from the host processor, adds forward error correction

(FEC) and error detection (CRC) information and interleaves the result for burst-error protection. After adding

symbol and frame synchronisation codewords and channel status symbols, it converts the packet into a

filtered analogue baseband signal for modulating the radio transmitter.

In receive mode, the CMX969 performs the reverse function using the analogue baseband signals from the

receiver frequency discriminator. After error correction and removal of the packet overhead, the recovered

application data is supplied to the host processor. Any residual uncorrected errors in the data will be flagged.

A readout of the received signal quality is also provided.

An optional Autonomous Frame Sync Detection function is provided for use in Motient/ARDIS systems

employing Single Frequency Re-use operation.

The CMX969 uses signal filtering, data block formats and FEC/CRC algorithms compatible with the MDC and

RD-LAP over-air standards. The device is programmable to operate from a wide choice of Xtal frequencies

and is available in 24 pin DIP, SSOP and TSSOP packages.

2001

Consumer Microcircuits Limited

RD-LAP/MDC4800 Motient/ARDIS

CMX969

CONTENTS

Section

1.0

1.1

1.2

1.3

1.4

1.5

Page

Features and Applications.......................................................................1

Brief Description .......................................................................................1

Block Diagram ...........................................................................................3

Signal List...................................................................................................4

External Components ...............................................................................5

General Description ..................................................................................6

1.5.1 Description of Blocks..................................................................6

1.5.2 Modem - µC Interaction...............................................................8

1.5.3 Binary to RD-LAP 4-Level Symbol Translation .......................9

1.5.4 Frame Structure .........................................................................10

1.5.4.1 MDC Mode...................................................................................10

1.5.4.2 RD-LAP Mode .............................................................................11

1.5.5 The Programmer's View ............................................................12

1.5.5.1 Data Block Buffer.......................................................................12

1.5.5.2 Control Register.........................................................................12

1.5.5.3 Mode Register ............................................................................13

1.5.5.4 Command Register ....................................................................15

1.5.5.5 Status Register...........................................................................26

1.5.5.6 Data Quality Register ................................................................28

Application Notes....................................................................................29

1.6.1 Autonomous Frame Sync Detect Function............................29

1.6.2 Rx Control Procedure................................................................30

Performance Specification.....................................................................32

1.7.1 Electrical Performance..............................................................32

1.7.1.1 Absolute Maximum Ratings .....................................................32

1.7.1.2 Operating Limits.........................................................................32

1.7.1.3 Operating Characteristics ........................................................33

1.7.2 Packaging....................................................................................36

1.6

1.7

2001

Consumer Microcircuits Limited

D/969/5

CMX969P4 Related Products

	CMX969P4	CMX969D5	CMX969E2
Description	Modem-Support Circuit, 19.2kbps Data, CMOS, PDIP24, DIP-24	Modem-Support Circuit, 19.2kbps Data, CMOS, PDSO24, SSOP-24	Modem-Support Circuit, 19.2kbps Data, CMOS, PDSO24, TSSOP-24
Maker	CML Microcircuits	CML Microcircuits	CML Microcircuits
Parts packaging code	DIP	SSOP	TSSOP
package instruction	DIP, DIP24,.6	SSOP, SSOP24,.3	TSSOP, TSSOP24,.25
Contacts	24	24	24
Reach Compliance Code	compliant	compliant	compliant
data rate	19.2 Mbps	19.2 Mbps	19.2 Mbps
JESD-30 code	R-PDIP-T24	R-PDSO-G24	R-PDSO-G24
length	31.37 mm	8.2 mm	7.8 mm
Number of functions	1	1	1
Number of terminals	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SSOP	TSSOP
Encapsulate equivalent code	DIP24,.6	SSOP24,.3	TSSOP24,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.59 mm	2 mm	1.2 mm
Maximum slew rate	0.009 mA	0.009 mA	0.009 mA
Nominal supply voltage	3.3 V	3.3 V	3.3 V
surface mount	NO	YES	YES
technology	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL
width	15.24 mm	5.3 mm	4.4 mm
Is it lead-free?	-	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to
JESD-609 code	-	e3	e3
Peak Reflow Temperature (Celsius)	-	260	260
Terminal surface	-	Matte Tin (Sn)	Matte Tin (Sn)
Maximum time at peak reflow temperature	-	40	40

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