SMBJ7.0 datasheet, PDF - EEWORLD Datasheet

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SMBJ7.0: Description600 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA; Categorysemiconductor Discrete semiconductor; File Size788KB，4 Pages; ManufacturerSSC; Websitehttp://www.siliconstandard.com/

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SMBJ7.0 Overview

600 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA

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SMBJ Series

Transient Voltage Suppressors

PRODUCT SUMMARY

Stand-off Voltage ratings from 5.0V to 440V

Peak pulse power 600W in SMB surface-mount package

FEATURES

Plastic package has Underwriters Laboratory Flammability

Classification 94V-0

Low profile package with built-in strain relief for surface-mount

Glass passivated junction

Low incremental surge resistance, excellent clamping capability

Peak pulse power capability of 600W with a 10/1000us waveform,

repetition rate (duty cycle): 0.01%

Very fast response time

High temperature soldering guaranteed:

260°C for 10 seconds at terminals

MECHANICAL DATA

Case: JEDEC DO-214AA (SMB) molded plastic over passivated chip

Terminals: Matte-Sn plated, solderable per MIL-STD-750,

Method 2026

Polarity: For uni-directional types the band denotes the cathode, which

is positive with respect to the anode under normal TVS operation.

Mounting position: Any

Weight: 0.003oz., 0.093g

Pb-free; RoHS-compliant

Devices for Bidirectional Applications

For bi-directional devices, use suffix CA (e.g. SMBJ10CA). Electrical characteristics apply in both directions.

MAXIMUM RATINGS

Rating at 25°C ambient temperature unless otherwise specified.

Parameter

Peak pulse power dissipation with

a 10/1000

s waveform

(1,2)

(see Fig. 1)

Peak pulse current with a 10/1000

s waveform

(1)

Peak forward surge current, 8.3ms single half sine-wave

uni-directional only

(2)

Typical thermal resistance, junction to ambient

(3)

Typical thermal resistance, junction to lead

Operating junction and storage temperature range

Symbol

PPM

FSM

, T

STG

Value

Minimum 600

See Next Table

100

-55 to +150

Unit

°C/W

°C

Notes:

1. Non-repetitive current pulse, per Fig. 3 and derated above T

=25°C per Fig. 2.

2. Mounted on 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pads at each terminal

3. Mounted on minimum recommended pad layout

9/21/2006 Rev.4.01

www.SiliconStandard.com

1 of 4

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