ASMT-Bx20
PCB Based Subminiature Lamps (PCB PolyLED)
Data Sheet
Description
The ASMT-Bx20 is an environmental friendly green
product of unique PCB based subminiature lamps,
namely PCB PolyLED. These PolyLEDs come in un-tinted,
non-diffused package to cater for various product themes
and ease handling applications.
The small size, narrow footprint, and high brightness
make these LEDs excellent for backlighting, status indica-
tion, and panel illumination applications.
The available colors are AllnGaP Red, AllnGaP Green,
InGaN Blue, and AllnGaP Amber.
In order to facilitate pick and place operation, these PCB
PolyLEDs are shipped in tape and reel, with 1500 units
per reel. The package is compatible with reflow soldering
and binned by both color and intensity.
Features
•
Small foot print
•
Available in four colors
•
Low power consumption
•
Non-diffused dome for high brightness
•
Supreme product quality and reliability
•
Operating temperature range of -40
°C
to +85°C
•
Package in 8mm tape on 7” diameter reels
•
Compatible with automated placement equipment
•
Compatible with infrared and vapor phase reflow
soldering process
Applications
•
Panel indicator
•
LCD backlighting
•
Symbol backlighting
•
Push-button backlighting
•
Indoor mono/full color sign
Package Dimensions
Notes:
1. All dimensions in millimeters.
2. Tolerance is ±0.1mm unless otherwise specified.
Device Selection Guide
Part Number
ASMT-BA20
ASMT-BG20
ASMT-BR20
ASMT-BB20
Die Technology
AlInGaP
AlInGaP
AlInGaP
InGaN
Color
Amber
Green
Red
Blue
Package Description
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Non-diffused
Part Numbering System
ASMT - B x 20 - x x x x 0
Please refer to the Color Bin Limits Table.
Color Bin Selection
Max Iv Bin Options
Min Iv Bin Options
Die Technology
A: AllnGaP
N: InGaN
A: Amber
G: Green
R: Red
B: Blue
Please refer to the Iv Bin Table
Please refer to the Iv Bin Table
Color
Absolute Maximum Ratings at T
A
= 25
°
C
Parameter
DC Forward Current
[1]
Reverse Voltage (I
R
= 100mA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature (Pb Free)
AlInGaP
30
5
95
-40 to +85
-40 to +85
InGaN
20
5
95
Units
mA
V
°C
°C
°C
260°C for 10 seconds
Electrical Characteristics at T
A
= 25
°
C
Forward Voltage
V
F
(Volts)
[1]
@ I
F
= 20mA
Typ.
Max.
2.0
2.0
2.0
3.2
2.4
2.4
2.4
3.8
Part Number
AlInGaP Amber
AlInGaP Green
AlInGaP Red
InGaN Blue
Notes:
1. Vf tolerance : ±0.1V
Reverse Breakdown
V
R
(Volts) @ I
R
= 100μA
Min.
5
5
5
5
Thermal Resistance
Rθ
J-PIN
(°C/W)
Typ.
450
450
450
450
Optical Characteristics at T
A
= 25
°
C
Luminous Intensity
I
V [1]
(mcd) @ 20mA
Typ.
750
650
650
650
Part Number
AlInGaP Amber
AlInGaP Green
AlInGaP Red
InGaN Blue
Peak Wavelength
λpeak
(nm)
Typ.
592
565
635
470
Dominant Wavelength
λ
d [2]
(nm)
Typ.
590
569
626
468
Viewing Angle
2θ
1/2 [3]
(Degrees)
Typ.
15
15
15
15
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
package.
2. The dominant wavelength,
λ
d
, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3.
θ
1/2
is the off-axis angle where the luminous intensity is ½ the peak intensity.
Light Intensity (I
V
) Bin Limits
[1]
Bin ID
P
Q
R
S
T
U
V
W
X
Y
Tolerance : ±15%
Green Color Bins
[1]
Bin ID
1
2
3
4
5
Tolerance : ±1 nm
Intensity (mcd)
Minimum
Maximum
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
Dominant Wavelength (nm)
Minimum
Maximum
561.5
564.5
567.5
570.5
573.5
564.5
567.5
570.5
573.5
576.5
Red Color Bins
[1]
Bin ID
-
Tolerance : ±1 nm
Dominant Wavelength (nm)
Minimum
Maximum
620.0
635.0
Color Bin Limits
[1]
Amber Color Bins
[1]
Bin ID
1
2
3
4
5
6
Tolerance : ±1 nm
Blue Color Bins
[1]
Dominant Wavelength (nm)
Minimum
Maximum
582.0
584.5
587.0
589.5
592.0
594.5
584.5
587.0
589.5
592.0
594.5
597.0
Bin ID
1
2
3
4
Tolerance : ±1 nm
Dominant Wavelength (nm)
Minimum
Maximum
460.0
465.0
470.0
475.0
465.0
470.0
475.0
480.0
Notes:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago
representative for information on current available bins.
1.0
RELATIVE INTENSITY
0.8
0.6
0.4
0.2
0.0
380
Figure 3. Recommended soldering land pattern.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified.
InGaN
Blue
AllnGaP
Green
AllnGaP
Amber
AllnGaP
Red
480
580
WAVELENGTH - nm
680
780
Figure 4. Relative intensity vs. wavelength
35
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
30
FORWARD CURRENT - mA
25
20
15
10
5
0
0
1
2
FORWARD VOLTAGE - V
3
4
AllnGaP
InGaN
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
DC FORWARD CURRENT - mA
30
35
InGaN
AllnGaP
Figure 5. Forward current vs. forward voltage
Figure 6. Relative luminous intensity vs. DC forward current
35
MAXIMUM FORWARD CURRENT - mA
30
25
20
15
10
5
0
0
InGaN
AllnGaP
20
40
60
80
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
NORMALIZED INTENSITY
-90
AMBIENT TEMPERATURE - °C
Figure 7. Maximum forward current vs. ambient temperature
For AllnGap & InGaN Derating based on TJMAX = 95°
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
90
Figure 8. Radiation Pattern
10 SEC. MAX.
3°C/SEC. MAX.
125-170°C
2-3°C/SEC
120 SEC. MAX.
TIME
60-150
SEC.
TEMPERATURE
+5
230 - 0
°C
MAX.
183°C
3-4°C/SEC.
50°C
25°C
TIME
217
°C
200
°C
150
°C
3
°C/SEC.
MAX.
60-120SEC.
255 - 260
°C
3
°C/SEC.
MAX.
10 to 30 SEC.
TEMPERATURE
6
°C/SEC.
MAX.
100 SEC. MAX.
(Acc. to J-STD-020C)
Figure 9. Recommended reflow soldering profile
Figure 10. Recommended Pb-free reflow soldering profile
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 11. Reeling orientation
Microcontroller MCU
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