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MB201209Z121

Description
MULTILAYER CHIP BEADS
File Size225KB,11 Pages
ManufacturerProductwell Precision Elect.CO.,LTD
Websitehttp://www.productwell.com
Download Datasheet View All

MB201209Z121 Overview

MULTILAYER CHIP BEADS

MB SERIES
MECHANICALS
MULTILAYER CHIP BEADS
l
FEATURE
1. The small size chips generating high impedance.
2. Either flow or reflow soldering methods can be used
due to electroplating of the terminal electrodes.
3. High reliability due to an entirely monolithic structure
4. Low DC resistance structure of electrode prevents
wasteful electric power consumption
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APPLICATIONS
1. computers and peripheral equipment;
2. VCRs, Television,pagers
3. Cellular phones;
4. digital communication equipent;
5.Various electronics equipments;
6.Circuit where a stable ground is unavailable.
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TYPE AND DIMENSIONS
TYPE
MB453215
(1812)
MB451616
(1806)
MB322513
(1210)
MB 321616
(1206)
MB 321611
(1206)
MB 201209
(0805)
MB160808
(0603)
A
4.5±0.2
(0.177±0.008)
4.5±0.2
(0.177±0.008)
3.2±0.2
(0.126±0.008)
3.2±0.2
(0.126±0.008)
3.2±0.2
(0.126±0.008)
2.0±0.2
(0.079±0.008)
1.6±0.2
(0.063±0.008)
B
3.2±0.2
(0.126±0.008)
1.6±0.2
(0.063±0.008)
2.5±0.2
(0.098±0.008)
1.6±0.2
(0.063±0.008)
1.6±0.2
(0.063±0.008)
1.2±0.2
(0.047±0.008)
0.8±0.2
(0.031±0.008)
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特性
1.
尺寸小同時具有高阻值
2.
由于外電極是電鍍而成﹐適用
flow
reflow
兩種焊錫方式
3.
單石結構具有高信賴性
4.
電極之½直流阻抗可避免無謂的電
力損耗
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用途
1.
電腦及周邊設備
2.
錄放½機﹐電視機﹐呼叫器
3.
手提電話
4.
數½通訊設備
5.
個種電子設備
6.
缺乏穩定基板之電路
C
1.5±0.2
(0.059±0.008)
1.6±0.2
(0.063±0.008)
1.3±0.2
(0.051±0.008)
1.6±0.2
(0.063±0.008)
1.1±0.2
(0.043±0.008)
0.9±0.2
(0.035±0.008)
0.8±0.2
(0.031±0.008)
D
0.5±0.3
(0.020±0.012)
0.5±0.3
(0.020±0.012)
0.5±0.3
(0.020±0.012)
0.5±0.3
(0.020±0.012)
0.5±0.3
(0.020±0.012)
0.5±0.3
(0.020±0.012)
0.5±0.3
(0.020±0.012)
12
Productwell Precision Elect.Co.,Ltd
Kai Ping Productwell Precision Elect.Co.,Ltd Tel:0750-2323113 Fax:0750-2312333 http:// www.productwell.com

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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