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9LPRS535BGLFT

Description
Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size217KB,17 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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9LPRS535BGLFT Overview

Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48

9LPRS535BGLFT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeTSSOP
package instruction6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48
Contacts48
Reach Compliance Codecompliant
JESD-30 codeR-PDSO-G48
JESD-609 codee3
length12.5 mm
Number of terminals48
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage3.465 V
Minimum supply voltage3.135 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width6.1 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
Integrated
Circuit
Systems, Inc.
ICS9LPRS535
Datasheet
48-pin CK505 for Intel Systems
Recommended Application:
48-pin Low Cost CK505 w/fully integrated VREG and series
resistors on differential outputs
Output Features:
Integrated Series Resistors on differential outputs
2 - CPU differential push-pull pairs
4 - SRC differential push-pull pairs
1 - CPU/SRC selectable differential push-pull pair
1 - SRC/DOT selectable differential push-pull pair
1- SRC/Stop_Inputs selectable differential push-pull pair
1 - 25MHz SE1 output for Wake-on-Lan applications
3 - PCI, 33MHz
1 - USB, 48MHz
1 - REF, 14.31818MHz
Key Specifications:
CPU outputs cycle-cycle jitter < 85ps
SRC output cycle-cycle jitter < 125ps
PCI outputs cycle-cycle jitter < 250ps
+/-100ppm frequency accuracy on all clocks
Pin Configuration
Features/Benefits:
Supports spread spectrum modulation, default is 0.5%
down spread
Uses external 14.318MHz crystal, external crystal load
caps are required for frequency tuning
Not recommended for new designs. The last time
buy date for this product is 5/19/2011. Please refer
to PDN K-10-18.
Table 1: CPU Frequency Select Table
FS
L
C
B0b7
0
0
0
0
1
1
1
1
2
FS
L
B
B0b6
0
0
1
1
0
0
1
1
1
FS
L
A
B0b5
0
1
0
1
0
1
0
1
1
CPU
MHz
266.66
133.33
200.00
166.66
333.33
100.00
400.00
SRC
MHz
PCI
MHz
REF
MHz
U
SB
MHz
DOT
MHz
100.00
33.33
14.318
48.00
96.00
Reserved
1. FS
L
A and FS
L
B are low-threshold inputs.Please see V
IL_FS
and V
IH_FS
specifications in
the Input/Supply/Common Output Parameters Table for correct values.
Also refer to the Test Clarification Table.
2. FS
L
C is a three-level input. Please see the V
IL_FS
and V
IH_FS
specifications in the Input/Supply/Common Output Parameters Table for correct values.
PCI0/CR#_A
VDDPCI
PCI4/SRC5_EN
PCI_F5/ITP_EN
GNDPCI
VDD48
USB_48MHz/FSLA
GND48
VDD96_IO
DOT96T_LPR/SRCT0_LPR
DOT96C_LPR/SRCC0_LPR
GND
VDD
SE1
GND
SRCT2_LPR/SATAT_LPR
SRCC2_LPR/SATAC_LPR
GNDSRC
SRCT3_LPR/CR#_C
SRCC3_LPR/CR#_D
VDDSRC_IO
SRCT4_LPR
SRCC4_LPR
CPU_STOP#/SRCC5_LPR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
SCLK
SDATA
REF0/FSLC/TEST_SEL
VDDREF
X1
X2
GNDREF
FSLB/TEST_MODE
CK_PWRGD/PD#
VDDCPU
CPUT0_LPR
CPUC0_LPR
GNDCPU
CPUT1_LPR_F
CPUC1_LPR_F
VDDCPU_IO
CPUT2_ITP_LPR/SRCT8_LPR
CPUC2_ITP_LPR/SRCC8_LPR
VDDSRC_IO
SRCT7_LPR/CR#_F
SRCC7_LPR/CR#_E
GNDSRC
VDDSRC
PCI_STOP#/SRCT5_LPR
48-SSOP/TSSOP
* Internal Pull-Up Resistor
** Internal Pull-Down Resistor
1461A—07/28/09
ADVANCE INFORMATION
documents contain information on products in the formative or design phase development. Characteristic data and other specifications are design goals.
ICS reserves the right to change or discontinue these products without notice. Third party brands and names are the property of their respective owners.
9LPRS535

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Description Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48 Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48 Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48 Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48 Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Parts packaging code TSSOP SSOP SSOP SSOP TSSOP SSOP TSSOP TSSOP
package instruction 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 0.300 INCH, MO-118, SSOP-48 0.300 INCH, MO-118, SSOP-48 0.300 INCH, MO-118, SSOP-48 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 SSOP, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48
Contacts 48 48 48 48 48 48 48 48
Reach Compliance Code compliant compliant compliant compliant compliant compliant unknown unknown
JESD-30 code R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
length 12.5 mm 15.875 mm 15.875 mm 15.875 mm 12.5 mm 15.875 mm 12.5 mm 12.5 mm
Number of terminals 48 48 48 48 48 48 48 48
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SSOP SSOP SSOP TSSOP SSOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 2.8 mm 2.8 mm 2.8 mm 1.2 mm 2.8 mm 1.2 mm 1.2 mm
Maximum supply voltage 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.635 mm 0.635 mm 0.635 mm 0.5 mm 0.635 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 6.1 mm 7.5 mm 7.5 mm 7.5 mm 6.1 mm 7.5 mm 6.1 mm 6.1 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free - -
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
JESD-609 code e3 e3 e3 e3 e3 e3 - -
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 - -
Terminal surface MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN Matte Tin (Sn) - -
Maximum time at peak reflow temperature 30 30 30 30 30 30 - -
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