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NSVBCP68T1G

Description
NPN Bipolar Transistor, SOT-223 (TO-261) 4 LEAD, 1000-REEL
CategoryDiscrete semiconductor    The transistor   
File Size136KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance  
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NSVBCP68T1G Overview

NPN Bipolar Transistor, SOT-223 (TO-261) 4 LEAD, 1000-REEL

NSVBCP68T1G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
package instructionSMALL OUTLINE, R-PDSO-G4
Contacts4
Manufacturer packaging code0.0318
Reach Compliance Codeunknown
Shell connectionCOLLECTOR
Maximum collector current (IC)1 A
Collector-emitter maximum voltage20 V
ConfigurationSINGLE
Minimum DC current gain (hFE)60
JEDEC-95 codeTO-261
JESD-30 codeR-PDSO-G4
Number of components1
Number of terminals4
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeNPN
Maximum power dissipation(Abs)1.5 W
GuidelineAEC-Q101
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
transistor applicationsSWITCHING
Transistor component materialsSILICON
Nominal transition frequency (fT)60 MHz
VCEsat-Max0.5 V
NPN Silicon
Epitaxial Transistor
BCP68T1G
This NPN Silicon Epitaxial Transistor is designed for use in low
voltage, high current applications. The device is housed in the
SOT−223 package, which is designed for medium power surface
mount applications.
Features
www.onsemi.com
High Current
The SOT−223 Package Can Be Soldered Using Wave or Reflow
SOT−223 package ensures level mounting, resulting in improved
MEDIUM POWER NPN SILICON
HIGH CURRENT TRANSISTOR
SURFACE MOUNT
COLLECTOR 2,4
BASE
1
EMITTER 3
4
1
2
3
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die
The PNP Complement is BCP69T1
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable*
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(T
C
= 25°C unless otherwise noted)
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Collector Current
Peak (Note 2)
Base Current
Continuous
Base Current
Peak
Total Power Dissipation
@ T
A
= 25°C (Note 1)
Derate above 25°C
Operating and Storage Temperature
Range
Symbol
V
CEO
V
CBO
V
EBO
I
C
I
CM
I
B
I
BM
P
D
Value
20
25
5.0
1.0
3.0
0.4
0.4
1.5
12
−65
to 150
Unit
Vdc
Vdc
Vdc
Adc
Adc
Adc
Adc
W
mW/°C
°C
SOT−223
CASE 318E
STYLE 1
MARKING DIAGRAM
AYW
CA
G
G
T
J
, T
stg
CA = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
2. Reference SOA curve for IC peak.
ORDERING INFORMATION
Device
BCP68T1G
SBCP68T1G*,
NSVBCP68T1G*
BCP68T3G
Package
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
Shipping
1,000/Tape & Reel
1,000/Tape & Reel
4,000/Tape & Reel
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Ambient
(Surface Mounted)
Lead Temperature for Soldering,
0.0625 in from case
Time in Solder Bath
Symbol
R
qJA
T
L
Max
83.3
260
10
Unit
°C/W
°C
Sec
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2014
April, 2020
Rev. 10
1
Publication Order Number:
BCP68T1/D

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