F-212
(0,50mm) .0197"
BEC5C SERIES
BEC5C–140–02–L–SM–2–V–A
BEC5C–080–02–L–SM–2–V–A
LOW COST HIGH DENSITY EDGE CARD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BEC5C
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
Testing Now!
Voltage Rating:
Testing Now!
RoHS Compliant:
Yes
Mates with:
(1,60mm) .062" and
(2,40mm) .094" thick cards
APPLICATION
0,5mm
• Solder crimps
Lead-free
solder crimps
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,15mm) .006" max
Weld
Tab
BEC5C
ALSO AVAILABLE
• Tin-Lead Solder Charge.
• Other platings and
pin counts.
Call Samtec.
NO. OF
PINS
CARD
PLATING
OPTION
SM
2
V
A
OPTION
TR
–02
–080, –100,
–120, –140,
(Call Samtec
for other sizes)
= (1,60mm)
.062"
thick card
–L
= 10µ" (0,25µm) Gold on contact area,
Matte Tin on solder tail
–K
= (8,25mm) .325"
Polyimide film
Pick & Place Pad
–03
= (2,40mm)
.094"
thick card
NO. OF
POSITIONS
A
C
04
A
(29,00)
1.142
(34,00)
1.339
39
(39,00)
00
1.535
3
(44,00)
,0
1.732
73
B
(24,15)
.951
(29,15)
(29
1.148
1.14
(34,15)
15
1.344
1 4
(39,15)
(39
1.541
.5
C
(7,08)
.279
(7,08)
(7,08
.279
(12,08)
12
.475
.4
(12,08)
2
.475
47
D
(25,70)
1.012
(30,70)
1.209
1.20
(35,70)
(35,7
1.406
1 6
(40,70)
(40,70
1.602
02
E
(26,50)
1.043
1 043
(31,50)
(31
(
1.240
1.24
(36,50)
(3 50)
1.437
1
(41,50)
41
1.634
.6
(1,00)
.03937
(0,50) .0197
(9,00)
.354
.354
–080
–100
–120
2
–140
01
B
(13,00)
.512
(1,86)
.073
ot
ay
Note:
May not be suitable
appli
for hot plugging application,
ntact
contact Samtec engineering.
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
D
E
(1,25)
.049
(3,80)
.150
(1,25)
.049
(6,30)
.248
WWW.SAMTEC.COM
Embedded System
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