74AHC2G126 datasheet, PDF - EEWORLD Datasheet

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74AHC2G126: DescriptionDual buffer/line driver; 3-state; File Size75KB，15 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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74AHC2G126 Overview

Dual buffer/line driver; 3-state

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74AHC2G126; 74AHCT2G126

Dual buffer/line driver; 3-state

Rev. 04 — 27 April 2009

Product data sheet

1. General description

The 74AHC2G126 and 74AHCT2G126 are high-speed Si-gate CMOS devices. They

provide a dual non-inverting buffer/line driver with 3-state output. The 3-state output is

controlled by the output enable input (nOE). A LOW at nOE causes the output to assume

a high-impedance OFF-state.

The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.

The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

2. Features

Symmetrical output impedance

High noise immunity

Low power dissipation

Balanced propagation delays

Multiple package options

ESD protection:

HBM JESD22-A114E: exceeds 2000 V

MM JESD22-A115-A: exceeds 200 V

CDM JESD22-C101C: exceeds 1000 V

Speciﬁed from

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74AHC2G126DP

74AHCT2G126DP

74AHC2G126DC

74AHCT2G126DC

74AHC2G126GD

74AHCT2G126GD

−40 °C

to +125

°C

−40 °C

to +125

°C

VSSOP8

−40 °C

to +125

°C

TSSOP8

Description

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

plastic very thin shrink small outline package;

8 leads; body width 2.3 mm

Version

SOT505-2

SOT765-1

SOT996-2

Type number

XSON8U plastic extremely thin small outline package; no

leads; 8 terminals; UTLP based; body 3

0.5

74AHC2G126 Related Products

	74AHC2G126	74AHC2G126DP	74AHC2G126DC	74AHC2G126GD	74AHCT2G126	74AHCT2G126DC	74AHCT2G126DP	74AHCT2G126GD
Description	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state
Is it lead-free?	-	Lead free	Lead free	Lead free	-	Lead free	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to	-	conform to	conform to	conform to
Maker	-	NXP	NXP	NXP	-	NXP	NXP	NXP
Parts packaging code	-	SOIC	TSSOP	SON	-	TSSOP	SOIC	SON
package instruction	-	3 MM, PLASTIC, SOT505-2, TSSOP-8	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8	VSON, SOLCC8,.11,20	-	VSSOP, TSSOP8,.12,20	3 MM, PLASTIC, SOT505-2, TSSOP-8	VSON, SOLCC8,.11,20
Contacts	-	8	8	8	-	8	8	8
Reach Compliance Code	-	compli	compli	compli	-	compli	compli	compli
Control type	-	ENABLE HIGH	ENABLE HIGH	ENABLE HIGH	-	ENABLE HIGH	ENABLE HIGH	ENABLE HIGH
series	-	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHC/VHC/H/U/V	-	AHCT/VHCT/VT	AHCT/VHCT/VT	AHCT/VHCT/VT
JESD-30 code	-	S-PDSO-G8	R-PDSO-G8	R-PDSO-N8	-	R-PDSO-G8	S-PDSO-G8	R-PDSO-N8
JESD-609 code	-	e4	e4	e4	-	e4	e4	e4
length	-	3 mm	2.3 mm	3 mm	-	2.3 mm	3 mm	3 mm
Logic integrated circuit type	-	BUS DRIVER	BUS DRIVER	BUS DRIVER	-	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	-	0.008 A	0.008 A	0.008 A	-	0.008 A	0.008 A	0.008 A
Humidity sensitivity level	-	1	1	1	-	1	1	1
Number of digits	-	1	1	1	-	1	1	1
Number of functions	-	2	2	2	-	2	2	2
Number of ports	-	2	2	2	-	2	2	2
Number of terminals	-	8	8	8	-	8	8	8
Maximum operating temperature	-	125 °C	125 °C	125 °C	-	125 °C	125 °C	125 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C
Output characteristics	-	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE
Output polarity	-	TRUE	TRUE	TRUE	-	TRUE	TRUE	TRUE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TSSOP	VSSOP	VSON	-	VSSOP	TSSOP	VSON
Encapsulate equivalent code	-	TSSOP8,.16	TSSOP8,.12,20	SOLCC8,.11,20	-	TSSOP8,.12,20	TSSOP8,.16	SOLCC8,.11,20
Package shape	-	SQUARE	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	SQUARE	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE
method of packing	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	-	260	260	260	-	260	260	260
power supply	-	2/5.5 V	2/5.5 V	2/5.5 V	-	5 V	5 V	5 V
Prop。Delay @ Nom-Su	-	9.5 ns	9.5 ns	9.5 ns	-	9.5 ns	9.5 ns	9.5 ns
propagation delay (tpd)	-	14.5 ns	14.5 ns	14.5 ns	-	9.5 ns	9.5 ns	9.5 ns
Certification status	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.1 mm	1 mm	0.5 mm	-	1 mm	1.1 mm	0.5 mm
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	2 V	2 V	2 V	-	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	-	5 V	5 V	5 V
surface mount	-	YES	YES	YES	-	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS
Temperature level	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	-	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	-	GULL WING	GULL WING	NO LEAD	-	GULL WING	GULL WING	NO LEAD
Terminal pitch	-	0.65 mm	0.5 mm	0.5 mm	-	0.5 mm	0.65 mm	0.5 mm
Terminal location	-	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	30	30	30	-	30	30	30
width	-	3 mm	2 mm	2 mm	-	2 mm	3 mm	2 mm

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