74AHCT2G126 datasheet, PDF - EEWORLD Datasheet

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74AHCT2G126: DescriptionDual buffer/line driver; 3-state; File Size75KB，15 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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74AHCT2G126 Overview

Dual buffer/line driver; 3-state

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74AHC2G126; 74AHCT2G126

Dual buffer/line driver; 3-state

Rev. 04 — 27 April 2009

Product data sheet

1. General description

The 74AHC2G126 and 74AHCT2G126 are high-speed Si-gate CMOS devices. They

provide a dual non-inverting buffer/line driver with 3-state output. The 3-state output is

controlled by the output enable input (nOE). A LOW at nOE causes the output to assume

a high-impedance OFF-state.

The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.

The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

2. Features

Symmetrical output impedance

High noise immunity

Low power dissipation

Balanced propagation delays

Multiple package options

ESD protection:

HBM JESD22-A114E: exceeds 2000 V

MM JESD22-A115-A: exceeds 200 V

CDM JESD22-C101C: exceeds 1000 V

Speciﬁed from

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74AHC2G126DP

74AHCT2G126DP

74AHC2G126DC

74AHCT2G126DC

74AHC2G126GD

74AHCT2G126GD

−40 °C

to +125

°C

−40 °C

to +125

°C

VSSOP8

−40 °C

to +125

°C

TSSOP8

Description

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

plastic very thin shrink small outline package;

8 leads; body width 2.3 mm

Version

SOT505-2

SOT765-1

SOT996-2

Type number

XSON8U plastic extremely thin small outline package; no

leads; 8 terminals; UTLP based; body 3

0.5

74AHCT2G126 Related Products

	74AHCT2G126	74AHC2G126DP	74AHC2G126	74AHC2G126DC	74AHC2G126GD	74AHCT2G126DC	74AHCT2G126DP	74AHCT2G126GD
Description	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state
Is it lead-free?	-	Lead free	-	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	-	conform to	-	conform to	conform to	conform to	conform to	conform to
Maker	-	NXP	-	NXP	NXP	NXP	NXP	NXP
Parts packaging code	-	SOIC	-	TSSOP	SON	TSSOP	SOIC	SON
package instruction	-	3 MM, PLASTIC, SOT505-2, TSSOP-8	-	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8	VSON, SOLCC8,.11,20	VSSOP, TSSOP8,.12,20	3 MM, PLASTIC, SOT505-2, TSSOP-8	VSON, SOLCC8,.11,20
Contacts	-	8	-	8	8	8	8	8
Reach Compliance Code	-	compli	-	compli	compli	compli	compli	compli
Control type	-	ENABLE HIGH	-	ENABLE HIGH	ENABLE HIGH	ENABLE HIGH	ENABLE HIGH	ENABLE HIGH
series	-	AHC/VHC/H/U/V	-	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHCT/VHCT/VT	AHCT/VHCT/VT	AHCT/VHCT/VT
JESD-30 code	-	S-PDSO-G8	-	R-PDSO-G8	R-PDSO-N8	R-PDSO-G8	S-PDSO-G8	R-PDSO-N8
JESD-609 code	-	e4	-	e4	e4	e4	e4	e4
length	-	3 mm	-	2.3 mm	3 mm	2.3 mm	3 mm	3 mm
Logic integrated circuit type	-	BUS DRIVER	-	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	-	0.008 A	-	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
Humidity sensitivity level	-	1	-	1	1	1	1	1
Number of digits	-	1	-	1	1	1	1	1
Number of functions	-	2	-	2	2	2	2	2
Number of ports	-	2	-	2	2	2	2	2
Number of terminals	-	8	-	8	8	8	8	8
Maximum operating temperature	-	125 °C	-	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	-	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	-	TRUE	-	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TSSOP	-	VSSOP	VSON	VSSOP	TSSOP	VSON
Encapsulate equivalent code	-	TSSOP8,.16	-	TSSOP8,.12,20	SOLCC8,.11,20	TSSOP8,.12,20	TSSOP8,.16	SOLCC8,.11,20
Package shape	-	SQUARE	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE
method of packing	-	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	-	260	-	260	260	260	260	260
power supply	-	2/5.5 V	-	2/5.5 V	2/5.5 V	5 V	5 V	5 V
Prop。Delay @ Nom-Su	-	9.5 ns	-	9.5 ns	9.5 ns	9.5 ns	9.5 ns	9.5 ns
propagation delay (tpd)	-	14.5 ns	-	14.5 ns	14.5 ns	9.5 ns	9.5 ns	9.5 ns
Certification status	-	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.1 mm	-	1 mm	0.5 mm	1 mm	1.1 mm	0.5 mm
Maximum supply voltage (Vsup)	-	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	2 V	-	2 V	2 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	-	5 V	-	5 V	5 V	5 V	5 V	5 V
surface mount	-	YES	-	YES	YES	YES	YES	YES
technology	-	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	-	NICKEL PALLADIUM GOLD	-	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	-	GULL WING	-	GULL WING	NO LEAD	GULL WING	GULL WING	NO LEAD
Terminal pitch	-	0.65 mm	-	0.5 mm	0.5 mm	0.5 mm	0.65 mm	0.5 mm
Terminal location	-	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	30	-	30	30	30	30	30
width	-	3 mm	-	2 mm	2 mm	2 mm	3 mm	2 mm

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