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74AHC2G241

Description
Dual buffer/line driver; 3-state
File Size78KB,16 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74AHC2G241 Overview

Dual buffer/line driver; 3-state

74AHC2G241; 74AHCT2G241
Dual buffer/line driver; 3-state
Rev. 02 — 13 January 2009
Product data sheet
1. General description
The 74AHC2G241; 74AHCT2G241 is a high-speed Si-gate CMOS device.
The 74AHC2G241; 74AHCT2G241 is a dual non-inverting buffer/line driver with 3-state
outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A
HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state. A LOW
level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.
Schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise
and fall times.
2. Features
I
Symmetrical output impedance
I
High noise immunity
I
ESD protection:
N
HBM JESD22-A114E: exceeds 2000 V
N
MM JESD22-A115-A: exceeds 200 V
N
CDM JESD22-C101C: exceeds 1000 V
I
Low power dissipation
I
Balanced propagation delays
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74AHC2G241DP
74AHCT2G241DP
74AHC2G241DC
74AHCT2G241DC
74AHC2G241GD
74AHCT2G241GD
−40 °C
to +125
°C
XSON8U
−40 °C
to +125
°C
VSSOP8
−40 °C
to +125
°C
TSSOP8
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
Version
SOT505-2
Type number
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3
×
2
×
0.5 mm

74AHC2G241 Related Products

74AHC2G241 74AHC2G241DC 74AHC2G241GD 74AHC2G241DP 74AHCT2G241 74AHCT2G241DC P6SMBF11A 74AHCT2G241GD
Description Dual buffer/line driver; 3-state Dual buffer/line driver; 3-state Dual buffer/line driver; 3-state Dual buffer/line driver; 3-state Dual buffer/line driver; 3-state Dual buffer/line driver; 3-state Surface mounttransient voltage suppressor power 600watts Dual buffer/line driver; 3-state
Is it lead-free? - Lead free Lead free Lead free - Lead free - Lead free
Is it Rohs certified? - conform to conform to conform to - conform to - conform to
Maker - NXP NXP NXP - NXP - NXP
Parts packaging code - TSSOP SON SOIC - TSSOP - SON
package instruction - VSSOP, TSSOP8,.12,20 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT-996-2, UTLP-8 3 MM WIDTH, PLASTIC, SOT-505-2, TSSOP-8 - 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8 - VSON, SOLCC8,.11,20
Contacts - 8 8 8 - 8 - 8
Reach Compliance Code - compli compli compli - compliant - compliant
Control type - ENABLE LOW/HIGH ENABLE LOW/HIGH ENABLE LOW/HIGH - ENABLE LOW/HIGH - ENABLE LOW/HIGH
series - AHC/VHC/H/U/V AHC/VHC/H/U/V AHC/VHC/H/U/V - AHCT/VHCT/VT - AHCT/VHCT/VT
JESD-30 code - R-PDSO-G8 R-PDSO-N8 S-PDSO-G8 - R-PDSO-G8 - R-PDSO-N8
JESD-609 code - e4 e4 e4 - e4 - e4
length - 2.3 mm 3 mm 3 mm - 2.3 mm - 3 mm
Load capacitance (CL) - 50 pF 50 pF 50 pF - 50 pF - 50 pF
Logic integrated circuit type - BUS DRIVER BUS DRIVER BUS DRIVER - BUS DRIVER - BUS DRIVER
MaximumI(ol) - 0.008 A 0.008 A 0.008 A - 0.008 A - 0.008 A
Humidity sensitivity level - 1 1 1 - 1 - 1
Number of digits - 1 1 1 - 1 - 1
Number of functions - 2 2 2 - 2 - 2
Number of ports - 2 2 2 - 2 - 2
Number of terminals - 8 8 8 - 8 - 8
Maximum operating temperature - 125 °C 125 °C 125 °C - 125 °C - 125 °C
Minimum operating temperature - -40 °C -40 °C -40 °C - -40 °C - -40 °C
Output characteristics - 3-STATE 3-STATE 3-STATE - 3-STATE - 3-STATE
Output polarity - TRUE TRUE TRUE - TRUE - TRUE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code - VSSOP VSON TSSOP - VSSOP - VSON
Encapsulate equivalent code - TSSOP8,.12,20 SOLCC8,.11,20 TSSOP8,.16 - TSSOP8,.12,20 - SOLCC8,.11,20
Package shape - RECTANGULAR RECTANGULAR SQUARE - RECTANGULAR - RECTANGULAR
Package form - SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) - 260 260 260 - 260 - 260
power supply - 2/5.5 V 2/5.5 V 2/5.5 V - 5 V - 5 V
propagation delay (tpd) - 14.5 ns 14.5 ns 14.5 ns - 9.5 ns - 9.5 ns
Certification status - Not Qualified Not Qualified Not Qualified - Not Qualified - Not Qualified
Maximum seat height - 1 mm 0.5 mm 1.1 mm - 1 mm - 0.5 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V - 5.5 V - 5.5 V
Minimum supply voltage (Vsup) - 2 V 2 V 2 V - 4.5 V - 4.5 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V - 5 V - 5 V
surface mount - YES YES YES - YES - YES
technology - CMOS CMOS CMOS - CMOS - CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE - AUTOMOTIVE
Terminal surface - Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD - Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form - GULL WING NO LEAD GULL WING - GULL WING - NO LEAD
Terminal pitch - 0.5 mm 0.5 mm 0.65 mm - 0.5 mm - 0.5 mm
Terminal location - DUAL DUAL DUAL - DUAL - DUAL
Maximum time at peak reflow temperature - 30 30 30 - 30 - 30
width - 2 mm 2 mm 3 mm - 2 mm - 2 mm

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