Low-power dual D-type flip-flop; positive-edge trigger

| 74AUP2G80_08 | 74AUP2G80 | 74AUP2G80DC | 74AUP2G80GM | 74AUP2G80GD | 74AUP2G80GT | |
|---|---|---|---|---|---|---|
| Description | Low-power dual D-type flip-flop; positive-edge trigger | Low-power dual D-type flip-flop; positive-edge trigger | Low-power dual D-type flip-flop; positive-edge trigger | Low-power dual D-type flip-flop; positive-edge trigger | Low-power dual D-type flip-flop; positive-edge trigger | Low-power dual D-type flip-flop; positive-edge trigger |
| Is it Rohs certified? | - | - | conform to | conform to | conform to | conform to |
| Maker | - | - | NXP | NXP | NXP | NXP |
| Parts packaging code | - | - | TSSOP | QFN | SON | SON |
| package instruction | - | - | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-2, QFN-8 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8 | 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8 |
| Contacts | - | - | 8 | 8 | 8 | 8 |
| Reach Compliance Code | - | - | compli | compli | compli | compli |
| series | - | - | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 code | - | - | R-PDSO-G8 | S-PQCC-N8 | R-PDSO-N8 | R-PDSO-N8 |
| length | - | - | 2.3 mm | 1.6 mm | 3 mm | 1.95 mm |
| Load capacitance (CL) | - | - | 30 pF | 30 pF | 30 pF | 30 pF |
| Logic integrated circuit type | - | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Maximum Frequency@Nom-Su | - | - | 70000000 Hz | 70000000 Hz | 70000000 Hz | 70000000 Hz |
| MaximumI(ol) | - | - | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A |
| Humidity sensitivity level | - | - | 1 | 1 | 1 | 1 |
| Number of digits | - | - | 1 | 1 | 1 | 1 |
| Number of functions | - | - | 2 | 2 | 2 | 2 |
| Number of terminals | - | - | 8 | 8 | 8 | 8 |
| Maximum operating temperature | - | - | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| Output polarity | - | - | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | VSSOP | HVQCCN | VSON | VSON |
| Encapsulate equivalent code | - | - | TSSOP8,.12,20 | LCC8,.06SQ,20 | SOLCC8,.11,20 | SOLCC8,.04,20 |
| Package shape | - | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | - | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| method of packing | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | - | - | 260 | 260 | 260 | 260 |
| power supply | - | - | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V |
| Prop。Delay @ Nom-Su | - | - | 27.2 ns | 27.2 ns | 27.2 ns | 27.2 ns |
| propagation delay (tpd) | - | - | 27.2 ns | 27.2 ns | 27.2 ns | 27.2 ns |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Maximum supply voltage (Vsup) | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | - | - | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| Nominal supply voltage (Vsup) | - | - | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| surface mount | - | - | YES | YES | YES | YES |
| technology | - | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal form | - | - | GULL WING | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | - | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | - | - | DUAL | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | - | 30 | 30 | 30 | 30 |
| Trigger type | - | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| width | - | - | 2 mm | 1.6 mm | 2 mm | 1 mm |
| minfmax | - | - | 510 MHz | 510 MHz | 510 MHz | 510 MHz |