DIOTEC ELECTRONICS CORP.
18020 Hobart Blvd., Unit B
Gardena, CA 90248 U.S.A
Tel.: (310) 767-1052 Fax: (310) 767-7958
Data Sheet No. BUDI-2500D-1A
FEATURES
R
MECHANICAL SPECIFICATION
PROPRIETARY
SOFT GLASS
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
Die Size:
0.180"
Round
D
A
Soft Glass
Passivation
G
B
Silver Plated
Copper Slugs
Silicon Die
R
Large die for high power capability
F
Very low forward voltage drop
Built-in stress relief mechanism for die protection
MILLIMETERS
DIM
A
B
Protects expensive automotive electronics and mobile
equipment
D
F
G
MIN
5.36
1.98
4.72
MAX
5.56
2.18
4.93
INCHES
MIN
0.211
0.078
0.186
MAX
0.219
0.086
0.194
Silver plated substrates for easy soldering or installation
Soldering temperature: 250
o
C maximum
0.76 Typ
1.02 Typ
0.030 Typ
0.040 Typ
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified.
PARAMETER (TEST CONDITIONS)
Series Number
Maximum Recurrent Peak Reverse Voltage
Working Peak Reverse Voltage
Maximum DC Blocking Voltage
Non-repetitive Peak Reverse Voltage
(Half wave, Single phase, 60Hz peak)
Average Rectified Forward Current (Single phase, Resistive load,
60Hz)
Non-repetitive Peak Forward Surge Current
(Half wave, Single phase, 60Hz sine applied to rated load)
Maximum Instantaneous Forward Voltage
Maximum DC Reverse Current
At Rated DC Blocking Voltage
Operating & Storage Temperature Range
@ I
F
= 6 Amps
@ I
F
= 25 Amps
@ Tc = 25
o
C
SYMBOL
RATINGS
BAR BAR BAR BAR BAR BAR BAR
2500D 2501D 2502D 2504D 2506D 2508D 2510D
UNITS
V
RRM
V
RWM
V
DC
V
RSM
I
o
I
FSM
V
F
I
R
T
J
,T
STG
0.85
1.05
0.5
-65 to +175
60
120
240
480
25
AMPS
500
0.90
1.10
VOLTS
µA
°C
BAR25d
50
100
200
400
600
800
1000
VOLTS
720
960
1200
K3