LMV331MWC datasheet, PDF - EEWORLD Datasheet

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LMV331MWC: DescriptionIC COMPARATOR, 7000 uV OFFSET-MAX, 600 ns RESPONSE TIME, UUC, WAFER, Comparator; CategoryAnalog mixed-signal IC Amplifier circuit; File Size648KB，31 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LMV331MWC Overview

IC COMPARATOR, 7000 uV OFFSET-MAX, 600 ns RESPONSE TIME, UUC, WAFER, Comparator

LMV331MWC Parametric

Parameter Name	Attribute value
Maker	National Semiconductor（TI ）
Parts packaging code	WAFER
package instruction	DIE, WAFER
Reach Compliance Code	unknown
ECCN code	EAR99
Amplifier type	COMPARATOR
Maximum average bias current (IIB)	0.25 µA
Maximum bias current (IIB) at 25C	0.25 µA
Maximum input offset voltage	7000 µV
JESD-30 code	X-XUUC-N
Number of functions	1
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output type	OPEN-COLLECTOR
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	WAFER
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
power supply	2.7/5 V
Certification status	Not Qualified
Nominal response time	600 ns
Maximum slew rate	0.15 mA
Supply voltage upper limit	5.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BICMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER

LMV331MWC Related Products

	LMV331MWC	LMV393MWC	LMV331MDC	LMV339MWC	LMV339MDC
Description	IC COMPARATOR, 7000 uV OFFSET-MAX, 600 ns RESPONSE TIME, UUC, WAFER, Comparator	IC DUAL COMPARATOR, 7000 uV OFFSET-MAX, 600 ns RESPONSE TIME, UUC, WAFER, Comparator	IC COMPARATOR, 7000 uV OFFSET-MAX, 600 ns RESPONSE TIME, UUC, DIE, Comparator	IC QUAD COMPARATOR, 7000 uV OFFSET-MAX, 600 ns RESPONSE TIME, UUC, WAFER, Comparator	IC QUAD COMPARATOR, 7000 uV OFFSET-MAX, 600 ns RESPONSE TIME, UUC, DIE, Comparator
Parts packaging code	WAFER	WAFER	WAFER	WAFER	WAFER
package instruction	DIE, WAFER	DIE, WAFER	DIE, DIE OR CHIP	DIE, WAFER	DIE, DIE OR CHIP
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Amplifier type	COMPARATOR	COMPARATOR	COMPARATOR	COMPARATOR	COMPARATOR
Maximum average bias current (IIB)	0.25 µA	0.25 µA	0.25 µA	0.25 µA	0.25 µA
Maximum bias current (IIB) at 25C	0.25 µA	0.25 µA	0.25 µA	0.25 µA	0.25 µA
Maximum input offset voltage	7000 µV	7000 µV	7000 µV	7000 µV	7000 µV
JESD-30 code	X-XUUC-N	X-XUUC-N	X-XUUC-N	X-XUUC-N	X-XUUC-N
Number of functions	1	2	1	4	4
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output type	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE	DIE	DIE	DIE
Encapsulate equivalent code	WAFER	WAFER	DIE OR CHIP	WAFER	DIE OR CHIP
Package shape	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package form	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
power supply	2.7/5 V	2.7/5 V	2.7/5 V	2.7/5 V	2.7/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal response time	600 ns	600 ns	600 ns	600 ns	600 ns
Maximum slew rate	0.15 mA	0.25 mA	0.15 mA	0.35 mA	0.35 mA
Supply voltage upper limit	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	UPPER	UPPER	UPPER
Maker	National Semiconductor（TI ）	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）

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