Junction Temperature .....................................................+150NC
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
PVDD
= V
SHDN
= 5.0V, V
PGND
= 0V, A
V
= 12dB (GAIN = PGND), R
L
=
J,
R
L
connected between OUT+ to OUT-, AC measurement
bandwidth 20Hz to 22kHz, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25NC.) (Notes 1, 2)
PARAMETER
Supply Voltage Range
Undervoltage Lockout
Quiescent Supply Current
Shutdown Supply Current
Turn-On Time
Bias Voltage
SYMBOL
PVDD
UVLO
I
DD
I
SHDN
t
ON
V
BIAS
A
V
= 12dB
Input Resistance
R
IN
T
A
= +25°C,
single-ended
A
V
= 9dB
A
V
= 6dB
A
V
= 3dB
A
V
= 0dB
Connect GAIN to PGND
Connect GAIN to PGND
through 100kI
±5%
Voltage Gain
A
V
Connect GAIN to PVDD
Connect GAIN to PVDD
through 100kI
±5%
GAIN unconnected
Output Offset Voltage
V
OS
T
A
= +25°C (Note 3)
Into shutdown
Peak voltage,
A-weighted, 32
samples per second, Out of shutdown
R
L
= 8I (Notes 3, 4)
f
IN
= 1kHz, input referred
45
64
90
128
180
11.5
8.5
5.5
2.5
-0.5
PVDD falling
T
A
= +25NC
V
PVDD
= 3.7V
V
SHDN
= 0V, T
A
= +25NC
CONDITIONS
Inferred from PSRR test
MIN
2.5
1.5
1.8
1.2
0.95
< 0.1
3.4
V
PVDD
/2
70
100
140
200
280
12
9
6
3
0
Q1
-74
-60
80
dBV
12.5
9.5
6.5
3.5
+0.5
Q4.5
mV
dB
kI
10
10
TYP
MAX
5.5
2.2
1.8
UNITS
V
V
mA
FA
ms
V
Click and Pop
K
CP
Common-Mode Rejection Ratio
CMRR
dB
2
Maxim Integrated
MAX98304
Mono 3.2W Class D Amplifier
ELECTRICAL CHARACTERISTICS (continued)
(V
PVDD
= V
SHDN
= 5.0V, V
PGND
= 0V, A
V
= 12dB (GAIN = PGND), R
L
=
J,
R
L
connected between OUT+ to OUT-, AC measurement
bandwidth 20Hz to 22kHz, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25NC.) (Notes 1, 2)
PARAMETER
Power-Supply Rejection Ratio
(Note 3)
SYMBOL
CONDITIONS
V
PVDD
= 2.5V to 5.5V, T
A
= +25NC
PSRR
f = 217Hz
V
RIPPLE
= 200mV
P-P
THD+N = 10%,
f = 1kHz,
R
L
= 4I + 33FH
THD+N = 1%,
f = 1kHz,
R
L
= 4I + 33FH
THD+N = 10%,
f = 1kHz,
R
L
= 8I + 68FH
THD+N = 1%,
f = 1kHz,
R
L
= 8I + 68FH
Total Harmonic Distortion
Plus Noise
Oscillator Frequency
Spread-Spectrum Bandwidth
Efficiency
E
P
OUT
= 1.75W, R
L
= 8I
A
V
= 12dB
A
V
= 9dB
Noise
V
N
A-weighted (Note 3)
A
V
= 6dB
A
V
= 3dB
A
V
= 0dB
Output Current Limit
Thermal Shutdown Level
Thermal Shutdown Hysteresis
DIGITAL INPUT (SHDN)
Input-Voltage High
Input-Voltage Low
Input Leakage Current
V
INH
V
INL
V
PVDD
= 2.5V to 5.5V
V
PVDD
= 2.5V to 5.5V
T
A
= +25NC
1.4
0.4
Q1
I
LIM
f = 1kHz
f = 20kHz
V
PVDD
= 5.0V
V
PVDD
= 4.2V
V
PVDD
= 3.7V
V
PVDD
= 5.0V
V
PVDD
= 4.2V
V
PVDD
= 3.7V
V
PVDD
= 5.0V
V
PVDD
= 4.2V
V
PVDD
= 3.7V
V
PVDD
= 5.0V
V
PVDD
= 4.2V
V
PVDD
= 3.7V
R
L
= 4I
P
OUT
= 1W
R
L
= 8I
P
OUT
= 0.7W
MIN
72
TYP
90
80
84
84
3.2
2.2
1.7
2.6
1.8
1.4
1.8
1.2
0.96
1.4
1
0.8
0.03
0.03
300
±12.5
93
31
26
23
21
19
2.8
155
15
A
NC
NC
V
V
FA
FV
RMS
kHz
kHz
%
0.1
%
W
dB
MAX
UNITS
Output Power
P
OUT
THD+N
f
IN
= 1kHz
f
OSC
Note 1:
This device is 100% production tested at +25NC. All temperature limits are guaranteed by design.
Note 2:
Testing performed with a resistive load in series with an inductor to simulate an actual speaker load. For R
L
= 4I,
L = 33FH. For R
L
= 8I, L = 68FH.
Note 3:
Amplifier inputs AC-coupled to ground.
Note 4:
Mode transitions controlled by
SHDN.
Maxim Integrated
3
MAX98304
Mono 3.2W Class D Amplifier
Typical Operating Characteristics
(V
PVDD
= V
SHDN
= 5.0V, V
PGND
= 0V, A
V
= 6dB, R
L
=
J,
R
L
connected between OUT+ to OUT-, AC measurement bandwidth 20Hz
to 22kHz, T
A
= +25NC, unless otherwise noted.)
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. FREQUENCY
MAX98304 toc01
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. FREQUENCY
MAX98304 toc02
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. FREQUENCY
V
PVDD
= 3.7V
Z
LOAD
= 4I + 33µH
MAX98304 toc03
10
V
PVDD
= 5V
Z
LOAD
= 4I + 33µH
10
V
PVDD
= 4.2V
Z
LOAD
= 4I + 33µH
P
OUT
= 1W
10
1
THD+N (%)
P
OUT
= 2W
0.1
P
OUT
= 1.5W
1
THD+N (%)
1
THD+N (%)
0.1
0.1
P
OUT
= 0.8W
0.01
0.01
P
OUT
= 0.5W
0.01
P
OUT
= 0.2W
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. FREQUENCY
MAX98304 toc04
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. FREQUENCY
MAX98304 toc05
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. FREQUENCY
V
PVDD
= 3.7V
Z
LOAD
= 8I + 68µH
P
OUT
= 0.4W
P
OUT
= 0.2W
0.1
MAX98304 toc06
10
V
PVDD
= 5V
Z
LOAD
= 8I + 68µH
10
V
PVDD
= 4.2V
Z
LOAD
= 8I + 68µH
10
1
THD+N (%)
1
THD+N (%)
1
THD+N (%)
0.1
P
OUT
= 1.2W
0.1
P
OUT
= 0.6W
0.01
P
OUT
= 0.3W
0.01
P
OUT
= 0.2W
0.01
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. OUTPUT POWER
MAX98304 toc07
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. OUTPUT POWER
MAX98304 toc08
TOTAL HARMONIC DISTORTION PLUS
NOISE vs. OUTPUT POWER
V
PVDD
= 3.7V
Z
LOAD
= 4I + 33µH
MAX98304 toc09
100
10
THD+N (%)
1
0.1
0.01
V
PVDD
= 5V
Z
LOAD
= 4I + 33µH
100
10
THD+N (%)
1
0.1
0.01
V
PVDD
= 4.2V
Z
LOAD
= 4I + 33µH
100
10
THD+N (%)
1
0.1
0.01
f = 6000Hz
f = 1000Hz
f = 6000Hz
f = 1000Hz
f = 6000Hz
f = 1000Hz
f = 100Hz
0.001
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
OUTPUT POWER (W)
0.001
0
0.5
1.0
f = 100Hz
0.001
1.5
2.0
2.5
0
0.5
f = 100Hz
1.0
OUTPUT POWER (W)
1.5
2.0
OUTPUT POWER (W)
4
Maxim Integrated
MAX98304
Mono 3.2W Class D Amplifier
Typical Operating Characteristics (continued)
(V
PVDD
= V
SHDN
= 5.0V, V
PGND
= 0V, A
V
= 6dB, R
L
=
J,
R
L
connected between OUT+ to OUT-, AC measurement bandwidth 20Hz
I prepared an inf file for the device (generated by windriver). However, in XP, when the device is plugged in, only the hardware wizard pops up and the driver needs to be installed manually. Why can't...
[i=s] This post was last edited by Changjianze1 on 2018-6-21 08:45 [/i] [size=6] Check-in for the fifth task 2 [/size] Task 2: Get the key variables during FOC control: Ia, Ib, Ic, Ialpha, Ibeta, Id, ...
[i=s]This post was last edited by dontium on 2015-1-23 11:38[/i] I need an expert to help me analyze this, as it is really hard for beginners to understand it...
[i=s]This post was last edited by LlllL12 on 2019-7-2 17:23[/i]1. Title: OTL Power Amplifier Design
2. Design tasks and requirements:
Design and make a power amplifier circuit. The circuit design requ...
[Reposted from https://e2echina.ti.com/question_answer/microcontrollers/c2000/f/56/p/165972/488430?keyMatch=f280049%20CLBtisearch=Search-CN-Everything]Live lecturer: Tan HuiLive QA:
1. What is the max...
Entering the information age after the millennium, the huge demand for semiconductor chips has made China the world's largest semiconductor market. According to relevant data, the scale of my count...[Details]
On April 20, Alibaba Group announced that it would acquire
the
chip
company Zhongtian Microelectronics and invest in six
chip
companies. Yesterday, JD.com CEO Liu Qiangdong said in a...[Details]
On April 24, Sungrow released its annual financial report. The report shows that in 2017, Sungrow's global shipments reached 16.5GW, of which domestic shipments reached 13.2GW, a year-on-year incre...[Details]
Recently, the " ZTE
incident"
caused by the Sino-US trade war
has caused heated discussions in the electronics industry. It not only reflects that Chinese companies are lagging behind in the...[Details]
In Windows environment, the source code is encoded in UTF-8. If the source file created by STM32CubeMX contains Chinese comments, then using STM32CubeMX to regenerate the source code will cause the C...[Details]
A few days ago, Hanergy Chairman Li held a grand launch of Hanwa new products, which once again attracted the attention of the mass media to the development of photovoltaics. The unique Hanergy has gr...[Details]
This program mainly uses the comparison output function of the timer to generate PWM waves to control the LED. The comparison output of timer A corresponds to P2.3 P2.4. Therefore, a matching working...[Details]
1. Brief description A summary of "How to build uClinux kernel transplantation on ARMSYS development board with S3C44B0X as core", including the analysis of Bootloader function and the key co...[Details]
What are your expectations and ideas
for
the future of
Xiaomi Mi Band
?
Xiaomi Mi Band’s
official Weibo shared many netizens’ thoughts on
the future direction and functions
of Xiao...[Details]
WPG Holdings announced that its subsidiary Youshang has launched a wireless smoke alarm solution based on STM and Semtech . With the development of the national economy and the enhancement of...[Details]
The STM32 watchdog has two WWDG and IWDG. The biggest difference between the two is that IWDG has only one lower limit for feeding, while WWDG, as the name implies, must be fed within a range to ensu...[Details]
;The hardware connection circuit of the 51 single-chip microcomputer is as follows: ;P1.3 and P1.4 are each connected to a button; ;P0.0 and P0.3 are each connected to a light-emitting diode; ;P2.0~P...[Details]
Circuit: Using AT89S52 single chip microcomputer. P3.0 to P3.3 are connected to four external buttons. P3.4 to P3.7 are the bit selection ports for controlling the four digital tubes, and P1 is the s...[Details]
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
