DIODE UHF BAND, 30 V, SILICON, VARIABLE CAPACITANCE DIODE, DO-34, Variable Capacitance Diode
| Parameter Name | Attribute value |
| Maker | NXP |
| package instruction | O-LALF-W2 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Minimum breakdown voltage | 30 V |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Minimum diode capacitance ratio | 2 |
| Diode component materials | SILICON |
| Diode type | VARIABLE CAPACITANCE DIODE |
| frequency band | ULTRA HIGH FREQUENCY |
| JEDEC-95 code | DO-34 |
| JESD-30 code | O-LALF-W2 |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum operating temperature | 100 °C |
| Minimum operating temperature | -55 °C |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Certification status | Not Qualified |
| Maximum reverse current | 0.01 µA |
| Reverse test voltage | 28 V |
| surface mount | NO |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| BB417133 | BB417136 | BB417116 | BB417153 | BB417113 | BB417143 | |
|---|---|---|---|---|---|---|
| Description | DIODE UHF BAND, 30 V, SILICON, VARIABLE CAPACITANCE DIODE, DO-34, Variable Capacitance Diode | DIODE UHF BAND, 30 V, SILICON, VARIABLE CAPACITANCE DIODE, DO-34, Variable Capacitance Diode | DIODE UHF BAND, 30 V, SILICON, VARIABLE CAPACITANCE DIODE, DO-34, Variable Capacitance Diode | DIODE UHF BAND, 30 V, SILICON, VARIABLE CAPACITANCE DIODE, DO-34, Variable Capacitance Diode | DIODE UHF BAND, 30 V, SILICON, VARIABLE CAPACITANCE DIODE, DO-34, Variable Capacitance Diode | DIODE UHF BAND, 30 V, SILICON, VARIABLE CAPACITANCE DIODE, DO-34, Variable Capacitance Diode |
| package instruction | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Minimum breakdown voltage | 30 V | 30 V | 30 V | 30 V | 30 V | 30 V |
| Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Minimum diode capacitance ratio | 2 | 2 | 2 | 2 | 2 | 2 |
| Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Diode type | VARIABLE CAPACITANCE DIODE | VARIABLE CAPACITANCE DIODE | VARIABLE CAPACITANCE DIODE | VARIABLE CAPACITANCE DIODE | VARIABLE CAPACITANCE DIODE | VARIABLE CAPACITANCE DIODE |
| frequency band | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY |
| JEDEC-95 code | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 |
| JESD-30 code | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum operating temperature | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum reverse current | 0.01 µA | 0.01 µA | 0.01 µA | 0.01 µA | 0.01 µA | 0.01 µA |
| Reverse test voltage | 28 V | 28 V | 28 V | 28 V | 28 V | 28 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| Terminal form | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE |
| Terminal location | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |