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MS413RAA102JSZ

Description
General Purpose Inductor, 1uH, 5%, 1 Element, Ceramic-Core, SMD, 1111, CHIP, 1211
CategoryPassive components    inductor   
File Size158KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

MS413RAA102JSZ Overview

General Purpose Inductor, 1uH, 5%, 1 Element, Ceramic-Core, SMD, 1111, CHIP, 1211

MS413RAA102JSZ Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCOILCRAFT
package instruction1111
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes1111
structureChip
core materialCERAMIC
DC Resistance1.75 Ω
Nominal inductance(L)1 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height2.03 mm
Package length2.92 mm
Package formSMT
Package width2.79 mm
method of packingTR, Plastic, 7 Inch
Minimum quality factor (at nominal inductance)34
Maximum rated current0.37 A
self resonant frequency280 MHz
seriesMS413RAA
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
special characteristicsQ MEASURED AT 50MHZ
surface mountYES
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency25 MHz
Tolerance5%
1008 CHIP INDUCTORS
High-Reliability Chip Inductors
MS413RAA
• High SRF and excellent Q values
• Tight tolerances, many values at 1%
• 28 inductance values from 10 nH to 1 µH
Current Derating
120
110
100
90
80
70
60
50
30
20
10
0
-40
12 nH
-20
0
20
40
60
80
100
120
140 160
40
Typical Q vs Frequency
120
100
100
90
80
100 nH
Percent of rated
I
rms
The MS413RAA features high temperature materials that
allow operation in ambient temperatures up to 155°C
and a leach-resistant base metalization with tin-lead (Sn-
Pb) terminations that ensures the best possible board
adhesion.
47 nH
Q Factor
70
60
50
40
30
20
10
0
10
100
1000
10000
E
terminal
A
G
F
330 nH
750 nH
1800 nH
B
overall
F
Ambient temperature (°C)
25°C
C
I
J
I
H
D
Terminal wraparound:
approx 0.015/0,38 both ends
Frequency (MHz)
Typical L vs Frequency
Suggested
Land Pattern
A max B max
0.115 0.110
2,92
2,79
C max D ref
0.080 0.020
2,03
0,51
E
F
0.080 0.020
2,03 0,51
G
H
I
J
0.060 0.100 0.040 0.050
1,52 2,54 1,02 1,27
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing,
2.0 mm pocket depth
®
Document MS101-1 Revised 06/12/13
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
© Coilcraft, Inc. 2013
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