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BZM55C33P

Description
Zener Diode, 33V V(Z), 6.06%, 0.5W, Silicon, Unidirectional, HERMETIC SEALED, MICROMELF-2
CategoryDiscrete semiconductor    diode   
File Size85KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

BZM55C33P Overview

Zener Diode, 33V V(Z), 6.06%, 0.5W, Silicon, Unidirectional, HERMETIC SEALED, MICROMELF-2

BZM55C33P Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionO-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee3
Number of components1
Number of terminals2
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage33 V
surface mountYES
technologyZENER
Terminal surfaceMATTE TIN
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature10
Maximum voltage tolerance6.06%
Working test current5 mA
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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$ %    !"#
BZM55C2V0
THRU
BZM55C75
500 mW
Zener Diode
2.0 to 75 Volts
MICROMELF
Cathode Mark
Features
Saving space
Hermetic sealed parts
Fits onto SOD323/SOT23 footprints
Electrical data identical with the devices BZT55C…/TZMC…
Very sharp reverse characteristic
Low reverse current level
Very high stability
Available with tighter tolerances
Absolute Maximum Ratings
Symbol
P
D
T
J
T
STG
Rating
Power dissipation
Junction Temperature
Storage Temperature Range
Rating
500
175
-65 to +175
Unit
mW
C
B
A
Absolute Maximum Ratings
Symbol
R
thJA
Rating
Junction Ambient
Rating
500
Unit
K/W
DIM
A
B
C
INCHES
MIN
.071
.004
.047
DIMENSIONS
MM
MIN
1.8
.10
1.20
MAX
.079
.008
.051
MAX
2.0
.20
1.30
NOTE
Electrical Characteristics
Symbol
Rating
Rating
Unit
SUGGESTED SOLDER
PAD LAYOUT
0.039
V
F
Maximum Forward Voltage
(I
F
=200mAdc)
0.055”
1.5
V
0.030”
Revision: 4
www.mccsemi.com
1 of 3
2006/05/28
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