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HM4-6642-9

Description
512X8 OTPROM, 220ns, CQCC28, CERAMIC, LCC-28
Categorystorage    storage   
File Size38KB,8 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HM4-6642-9 Overview

512X8 OTPROM, 220ns, CQCC28, CERAMIC, LCC-28

HM4-6642-9 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionQCCN, LCC28,.45SQ
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time220 ns
JESD-30 codeS-CQCC-N28
JESD-609 codee0
length11.455 mm
memory density4096 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals28
word count512 words
character code512
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512X8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC28,.45SQ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height2.54 mm
Maximum standby current0.0001 A
Maximum slew rate0.029 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.455 mm
HM-6642
March 1997
512 x 8 CMOS PROM
Description
The HM-6642 is a 512 x 8 CMOS NiCr fusible link
Programmable Read Only Memory in the popular 24 pin,
byte wide pinout. Synchronous circuit design techniques
combine with CMOS processing to give this device high
speed performance with very low power dissipation.
On-chip address latches are provided, allowing easy
interfacing with recent generation microprocessors that use
multiplexed address/data bus structures, such as the 8085.
The output enable controls, both active low and active high,
further simplify microprocessor system interfacing by
allowing output data bus control independent of the chip
enable control. The data output latches allow the use of the
HM-6642 in high speed pipelined architecture systems, and
also in synchronous logic replacement functions.
Applications for the HM-6642 CMOS PROM include low
power handheld microprocessor based instrumentation and
communications systems, remote data acquisition and
processing systems, processor control store, and synchro-
nous logic replacement.
All bits are manufactured storing a logical “0” and can be
selectively programmed for a logical “1” at any bit location.
Features
• Low Power Standby and Operating Power
- ICCSB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100µA
- ICCOP . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA at 1MHz
• Fast Access Time. . . . . . . . . . . . . . . . . . . . . . 120/200ns
• Industry Standard Pinout
• Single 5.0V Supply
• CMOS/TTL Compatible Inputs
• Field Programmable
• Synchronous Operation
• On-Chip Address Latches
• Separate Output Enable
Ordering Information
PACKAGE
SBDIP
SMD#
SLIM SBDIP
SMD#
CLCC
SMD#
TEMPERATURE RANGE
-40
o
C to +85
o
C
-55
o
C to +125
o
C
-40
o
C to +85
o
C
-55
o
C to +125
o
C
-40
o
C to +85
o
C
-55
o
C to +125
o
C
120ns
HM1-6642B-9
5962-8869002JA
HM6-6642B-9
5962-8869002LA
-
5962-88690023A
200ns
HM1-6642-9
5962-8869001JA
HM6-6642-9
5962-8869001LA
HM4-6642-9
5962-88690013A
PKG. NO.
D24.6
D24.6
D24.3
D24.3
J28.A
J28.A
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
File Number
3012.1
6-1

HM4-6642-9 Related Products

HM4-6642-9 5962-88690023A HM6-6642B-9 HM6-6642-9 HM1-6642B-9 5962-8869002LA
Description 512X8 OTPROM, 220ns, CQCC28, CERAMIC, LCC-28 512X8 OTPROM, 140ns, CQCC28 512X8 OTPROM, 140ns, CDIP24 512X8 OTPROM, 220ns, CDIP24 512X8 OTPROM, 140ns, CDIP24 512X8 OTPROM, 140ns, CDIP24, SIDE BRAZED, DIP-24
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
package instruction QCCN, LCC28,.45SQ , DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.6 DIP, DIP24,.3
Reach Compliance Code not_compliant unknown not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 220 ns 140 ns 140 ns 220 ns 140 ns 140 ns
JESD-30 code S-CQCC-N28 S-CQCC-N28 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24 R-CDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 28 28 24 24 24 24
word count 512 words 512 words 512 words 512 words 512 words 512 words
character code 512 512 512 512 512 512
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 125 °C 85 °C 85 °C 85 °C 125 °C
Minimum operating temperature -40 °C -55 °C -40 °C -40 °C -40 °C -55 °C
organize 512X8 512X8 512X8 512X8 512X8 512X8
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - hot dipped
Terminal form NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location QUAD QUAD DUAL DUAL DUAL DUAL
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible
encapsulated code QCCN - DIP DIP DIP DIP
Encapsulate equivalent code LCC28,.45SQ - DIP24,.3 DIP24,.3 DIP24,.6 DIP24,.3
power supply 5 V - 5 V 5 V 5 V 5 V
Maximum standby current 0.0001 A - 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.029 mA - 0.046 mA 0.029 mA 0.046 mA 0.02 mA
Terminal pitch 1.27 mm - 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Parts packaging code - - DIP DIP DIP DIP
Contacts - - 24 24 24 24
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