REVISIONS
LTR
E
DESCRIPTION
Change to vendor similar part number for vendor CAGE number 61772
for devices 08KX, 09KX, 10KX, 11KX, 12KX, 13KX, 14KX, 15KX, and
16KX. Remove vendor CAGE number 61772 from devices 08YX,
09YX, 10YX, 11YX, 12YX, 13YX, 15YX, and 16YX. Change to vendor
similar part number for vendor CAGE number 65786 for devices 09
and 11. Add vendor CAGE number 50088 to the drawing as a source
of supply for devices 04JX and 05JX. Add vendor CAGE number
65896 to the drawing as a source of supply for devices 15 and 16.
Removed 4.3.3 from drawing. Editorial changes throughout.
Added provisions for the addition of QD certified parts to drawing.
Updated boilerplate. Added CAGE OC7V7 as supplier. - ksr
Correction to marking paragraph 3.5. Updated boilerplate paragraphs.
ksr
DATE (YR-MO-DA)
92-04-27
APPROVED
M. A. Frye
F
00-09-27
Raymond Monnin
G
05-03-11
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
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15
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16
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G
18
REV
SHEET
PREPARED BY
James E. Jamison
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1
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22
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2
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DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Ray Monnin
APPROVED BY
http://www.dscc.dla.mil
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
Don Cool
DRAWING APPROVAL DATE
84 – 08 - 24
REVISION LEVEL
MICROCIRCUITS, MEMORY,
DIGITAL, CMOS, 16K
(2048 X 8) BIT STATIC RAM,
MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
G
14933
1 OF
22
84036
DSCC FORM 2233
APR 97
.
5962-E215-05
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
84036
⏐
⏐
⏐
⏐
Drawing number
01
⏐
⏐
⏐
⏐
Device type
(see 1.2.1)
J
⏐
⏐
⏐
⏐
Case outline
(see 1.2.2)
X
⏐
⏐
⏐
⏐
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
Generic number 1/
Supply voltage variation
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
Address access time
200 ns (synchronous)
90 ns
90 ns
150 ns
200 ns
70 ns
120 ns (synchronous)
45 ns
45 ns
55 ns
55 ns
70 ns
70 ns
35 ns
120 ns
90 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
J
K
L
X
Y
Z
Descriptive designator
CDIP2-T24 or GDIP1-T24
CDFP3-F24 or GDFP2-F24
CDIP4-T24 or GDIP3-T24
CQCC1-N32
See Figure 1
CQCC1-N32
Terminals
24
24
24
32
24
32
Package style
dual-in-line package
flat package
dual-in-line package
rectangular chip carrier package
rectangular chip carrier package
rectangular chip carrier package with
castellated instead of chamfered
corners and extended pad metallization
at terminal number 1.
square chip carrier package
3
CQCC1-N28
28
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1/ Generic numbers are listed on the standardized military drawing source approval bulletin at the end of this Standard
Microcircuit Drawing and will also be listed in MIL-HDBK-103.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
84036
SHEET
G
2
1.3 Absolute maximum ratings.
Supply voltage range (V
CC
)---------------------------------- -0.3 V dc to +7.0 V dc 2/
Temperature under bias-------------------------------------- -55°C to +125°C
Storage temperature range---------------------------------- -55°C to +150°C
Maximum power dissipation (P
D
) -------------------------- 1.0 W
Lead temperature (soldering, 5 seconds)---------------- +275°C
Thermal resistance, junction-to-case (θ
JC
):-------------- See MIL-STD-1835
Case Y ---------------------------------------------------------- 30°C/W
Junction temperature (T
J
)------------------------------------ +150°C 3/
All input or output voltages with respect to ground ---- -0.3 V dc to V
CC
+0.3 V dc 4/
1.4 Recommended operating conditions.
Case operating temperature range (T
C
) --------------------55°C to +125°C
Input low voltage (V
IL
):
Device types 01 through 16 ----------------------------------0.3 V dc to 0.8 V dc 2/
Input high voltage (V
IH
):
Device types 01, 07--------------------------------------------2.4 V dc to VCC +0.3 V dc 2/
Device types 02 through 06, 08 through 16 ------------2.2 V dc to VCC +0.3 V dc 2/
Supply voltage range (V
CC
): ----------------------------------4.5 V dc to 5.5 V dc 2/
Minimum chip enable low time -----------------------------40 ns 5/
Minimum chip enable high time-----------------------------40 ns 5/
Maximum input rise time -------------------------------------40 ns
Maximum input fall time --------------------------------------40 ns
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
2/ All voltages referenced to V
SS
.
3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions
in accordance with method 5004 of MIL-STD-883.
4/ Negative undershoots to a minimum of -3.0 V are allowed with a maximum of 20 ns pulse width.
5/ For device types 02, 03, and 06 only.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
84036
SHEET
G
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535
is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the
alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or alternative approved by the Qualifying Activity.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Logic diagram(s). The logic diagram(s) shall be as specified on figure 4.
3.2.5 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only.
Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the
internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor
testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements as
provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked.
3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
Appendix A. For Class Q product built in accordance with A.3.2.2 of MIL-PRF-38535 or other alternative approved by the
Qualifying Activity, the "QD" certification mark shall be used in place of the "QML" or "Q" certification mark.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
84036
SHEET
G
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Test conditions 1/ 2/
V
SS
= 0 V, 4.5 V
≤
V
CC
≤
5.5 V
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
I
OH
= -1 mA
I
OH
= -4 mA
Group A
subgroups
Device
type
Min
Limits
Unit
Max
V
High-level output voltage
V
OH
1,2,3
1,2,3
01-07,
15,16
08-14
01,07
2.4
Low-level output voltage
V
OL
I
OL
= +3.2 mA
I
OL
= +4.0 mA
I
OL
= +2.0 mA
I
OL
= +8.0 mA
1,2,3
02,03,
06,15
04,05,
16
08-14
01,02,
06,07
04,05,
09,11,
13,14,
15,16
03,08,
10,12
0.4
V
High impedance output
leakage current
I
IOLZ
I
IOHZ
OE = V
IH
1,2,3
-1.0
-10.0
1.0
10.0
µA
-5.0
-1.0
-2.0
5.0
1.0
2.0
µA
Input leakage current
I
IL
I
IH
V
IN
= GND
V
IN
= 5.5 V
1,2,3
01,02,
06,07
04,05,
15
03,08,
10,12,
16
09,11,
13,14
01,07
-5.0
5.0
-10.0
10.0
10
mA
Operating supply current
I
CC1
V
CC
= 5.5 V, f = fmax 3/
CE = V
IL
, outputs open
All other inputs at V
IL
1,2,3
04,05,
13,15,
16
02,03,
06
08,10,
12
09,11
120
14
150
90
70
85
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
84036
SHEET
G
5
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