K4Y50024UE-JCA20 datasheet, PDF

Datasheet> All Categories > storage> storage> K4Y50024UE-JCA20

K4Y50024UE-JCA20: DescriptionRambus DRAM, 256MX2, 36ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100; Categorystorage storage; File Size3MB，76 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

Download Datasheet Parametric Compare View All

K4Y50024UE-JCA20 Overview

Rambus DRAM, 256MX2, 36ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100

K4Y50024UE-JCA20 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	TFBGA, BGA100,11X16,50/32
Contacts	100
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	BLOCK ORIENTED PROTOCOL
Maximum access time	36 ns
Other features	AUTO/SELF REFRESH
I/O type	COMMON
JESD-30 code	R-PBGA-B100
length	14.5 mm
memory density	536870912 bit
Memory IC Type	RAMBUS DRAM
memory width	2
Number of functions	1
Number of ports	1
Number of terminals	100
word count	268435456 words
character code	256000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	100 °C
Minimum operating temperature
organize	256MX2
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA100,11X16,50/32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	32768
Maximum seat height	1.13 mm
self refresh	YES
Maximum standby current	0.04 A
Maximum slew rate	0.71 mA
Maximum supply voltage (Vsup)	1.89 V
Minimum supply voltage (Vsup)	1.71 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

Preview

Download Datasheet

View All

K4Y50164UE

K4Y50084UE

K4Y50044UE

K4Y50024UE

XDR

DRAM

512Mbit XDR

DRAM(E-die)

Revision 1.0

Feb., 2007

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL

INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure could result in loss of life or personal or physical harm, or any military or

defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

XDR is a trademark of Rambus Inc.

1 of 76

Rev. 1.0 Feb. 2007

K4Y50024UE-JCA20 Related Products

	K4Y50024UE-JCA20	K4Y50044UE-JCB30	K4Y50044UE-JCC40	K4Y50164UE-JCA20	K4Y50024UE-JCC40	K4Y50044UE-JCA20	K4Y50164UE-JCC40	K4Y50164UE-JCB30	K4Y50024UE-JCB30
Description	Rambus DRAM, 256MX2, 36ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100	Rambus DRAM, 128MX4, 35ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100	Rambus DRAM, 128MX4, 28ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100	Rambus DRAM, 32MX16, 36ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100	Rambus DRAM, 256MX2, 28ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100	Rambus DRAM, 128MX4, 36ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100	Rambus DRAM, 32MX16, 28ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100	Rambus DRAM, 32MX16, 35ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100	Rambus DRAM, 256MX2, 35ns, CMOS, PBGA100, ROHS COMPLIANT, FBGA-100
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA100,11X16,50/32	TFBGA, BGA100,11X16,50/32	TFBGA, BGA100,11X16,50/32	TFBGA, BGA100,11X16,50/32	TFBGA, BGA100,11X16,50/32	TFBGA, BGA100,11X16,50/32	TFBGA, BGA100,11X16,50/32	TFBGA, BGA100,11X16,50/32	TFBGA, BGA100,11X16,50/32
Contacts	100	100	100	100	100	100	100	100	100
Reach Compliance Code	compliant	compliant	compliant	unknown	compliant	compliant	unknown	unknown	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL	BLOCK ORIENTED PROTOCOL
Maximum access time	36 ns	35 ns	28 ns	36 ns	28 ns	36 ns	28 ns	35 ns	35 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B100	R-PBGA-B100	R-PBGA-B100	R-PBGA-B100	R-PBGA-B100	R-PBGA-B100	R-PBGA-B100	R-PBGA-B100	R-PBGA-B100
length	14.5 mm	14.5 mm	14.5 mm	14.5 mm	14.5 mm	14.5 mm	14.5 mm	14.5 mm	14.5 mm
memory density	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bi
Memory IC Type	RAMBUS DRAM	RAMBUS DRAM	RAMBUS DRAM	RAMBUS DRAM	RAMBUS DRAM	RAMBUS DRAM	RAMBUS DRAM	RAMBUS DRAM	RAMBUS DRAM
memory width	2	4	4	16	2	4	16	16	2
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	100	100	100	100	100	100	100	100	100
word count	268435456 words	134217728 words	134217728 words	33554432 words	268435456 words	134217728 words	33554432 words	33554432 words	268435456 words
character code	256000000	128000000	128000000	32000000	256000000	128000000	32000000	32000000	256000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	100 °C	100 °C	100 °C	100 °C	100 °C	100 °C	100 °C	100 °C	100 °C
organize	256MX2	128MX4	128MX4	32MX16	256MX2	128MX4	32MX16	32MX16	256MX2
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA100,11X16,50/32	BGA100,11X16,50/32	BGA100,11X16,50/32	BGA100,11X16,50/32	BGA100,11X16,50/32	BGA100,11X16,50/32	BGA100,11X16,50/32	BGA100,11X16,50/32	BGA100,11X16,50/32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	32768	32768	32768	32768	32768	32768	32768	32768	32768
Maximum seat height	1.13 mm	1.13 mm	1.13 mm	1.13 mm	1.13 mm	1.13 mm	1.13 mm	1.13 mm	1.13 mm
self refresh	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum standby current	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A
Maximum slew rate	0.71 mA	0.95 mA	1.11 mA	0.92 mA	1.07 mA	0.74 mA	1.35 mA	1.15 mA	0.91 mA
Maximum supply voltage (Vsup)	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V	1.89 V
Minimum supply voltage (Vsup)	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

Recommended Resources

LT4060 2A Ni-MH battery charger with temperature control

Full-wave synchronous detection circuit using analog switch IC

LM909 (electronic toy) radio remote control receiving and decoding circuit

Voltage stabilization circuit diagram with adjustable output voltage

Battery charge and discharge protector

A high-precision automatic shifting proportional operational amplifier circuit

Send an avr code generator: Hehe, download it in Chinese...; yunzhaodu Microchip MCU

Instructions for using the STM32F7 HAL library!!!: There are some differences between the standard STM32 library and the HAL library. The code produced by STM32 CUBE uses the HAL library. Those who used the standard library before may need correspondi...; DavidZH stm32/stm8

Hello: :lol Hello everyone, please give me some advice!...; hi1023 Embedded System

Complete Collection of Filter Circuits: Complete Collection of Filter Circuits...; MichaelYonng Electronics Design Contest

Does anyone have the Chinese version of the RL78F12 chip datasheet?: Big guys, please help~...; YZJYZJYZJ Renesas Electronics MCUs

What's wrong with the watchdog timer being invalid? Is it an initialization problem?: #ifndef WDT_H_ #define WDT_H_ #includevoid WDT_init() {WDTCTL=WDT_ADLY_250;//250msSFRIE1 |= WDTIE;//WDT使能_enable_interrupts();// 总中断//_bis_SR_register(LPM0_bits + GIE);// Enter LPM0, enable interrupts...; one55 Microcontroller MCU

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components