
Synchronous DRAM, 32MX4, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | SAMSUNG |
| Parts packaging code | TSOP2 |
| package instruction | TSOP2, |
| Contacts | 54 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| access mode | FOUR BANK PAGE BURST |
| Maximum access time | 5.4 ns |
| Other features | AUTO/SELF REFRESH |
| JESD-30 code | R-PDSO-G54 |
| JESD-609 code | e6 |
| length | 22.22 mm |
| memory density | 134217728 bit |
| Memory IC Type | SYNCHRONOUS DRAM |
| memory width | 4 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 54 |
| word count | 33554432 words |
| character code | 32000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32MX4 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP2 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| self refresh | YES |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Bismuth (Sn/Bi) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |

| K4S280432F-UC750 | K4S280832F-UL750 | K4S281632F-UC750 | K4S280832F-UC750 | K4S281632F-UC75T | K4S280432F-UL750 | K4S281632F-UL750 | K4S281632F-UC600 | K4S281632F-UL600 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Synchronous DRAM, 32MX4, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 | Synchronous DRAM, 16MX8, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 | Synchronous DRAM, 16MX8, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 | Synchronous DRAM, 32MX4, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 | Synchronous DRAM, 8MX16, 5ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 | Synchronous DRAM, 8MX16, 5ns, CMOS, PDSO54, LEAD FREE, TSOP2-54 |
| Parts packaging code | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
| package instruction | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, |
| Contacts | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| Maximum access time | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5 ns | 5 ns |
| Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 code | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 |
| length | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm |
| memory density | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
| Memory IC Type | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| memory width | 4 | 8 | 16 | 8 | 16 | 4 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
| word count | 33554432 words | 16777216 words | 8388608 words | 16777216 words | 8388608 words | 33554432 words | 8388608 words | 8388608 words | 8388608 words |
| character code | 32000000 | 16000000 | 8000000 | 16000000 | 8000000 | 32000000 | 8000000 | 8000000 | 8000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 32MX4 | 16MX8 | 8MX16 | 16MX8 | 8MX16 | 32MX4 | 8MX16 | 8MX16 | 8MX16 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| self refresh | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | - | conform to | conform to | conform to | conform to |
| Maker | SAMSUNG | - | - | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
| Humidity sensitivity level | 3 | 3 | 2 | 2 | - | 3 | 2 | 2 | 2 |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | - | 260 | 260 | 260 | 260 |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 | - | NOT SPECIFIED | 40 | 40 | 40 |