H8/38024 Series, H8/38024F-ZTAT™
H8/38024 HD64738024, HD64338024, HCD64338024,
HD64F38024, HCD64F38024
H8/38023 HD64338023, HCD64338023
H8/38022 HD64338022, HCD64338022
H8/38021 HD64338021, HCD64338021
H8/38020 HD64338020, HCD64338020
Hardware Manual
ADE-602-231A
Rev. 2.0
2/20/02
Hitachi Ltd.
Cautions
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patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
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without written approval from Hitachi.
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semiconductor products.
Preface
The H8/300L Series of single-chip microcomputers has the high-speed H8/300L CPU at its core,
with many necessary peripheral functions on-chip. The H8/300L CPU instruction set is
compatible with the H8/300 CPU.
The H8/38024 Series has a system-on-a-chip architecture that includes such peripheral functions
as an LCD controller/driver, six timers, a two-channel 10-bit PWM, a serial communication
interface, and an A/D converter. This allows H8/38024 Series devices to be used as embedded
microcomputers in systems requiring LCD display.
Its on-chip ROM is PROM (ZTAT™), single-
power-supply flash memory (F-ZTAT™), and mask ROM that provides flexibility as it can be
reprogrammed in no time to cope with all situations from the early stages of mass production to
full-scale mass production. This is particularly applicable to application devices with
specifications that will most probably change.
This manual describes the hardware of the H8/38024 Series. For details on the H8/38024 Series
instruction set, refer to the H8/300L Series Programming Manual.
Notes:
Please follow the limitations below when developing a program and debugging H8/38024 using
the on-chip emulator (E10T).
1. The P95 pin is not available for use because it is dedicated to E10T.
2. The P33, P34, and P35 pins are also not available for use. To use these pins, additional
hardware is required on the user’s board.
3. Users cannot use the regions of addresses H'7000 to H'7FFF because they are used by E10T.
4. Regions of addresses H'F780 to H'FB7F must not be accessed.
5. When E10T is used, the P95 pin is for I/O, the P33 and P34 pins are for input, and the P35 pins
is for output.
List of Items Revised or Added for This Version
Section
1.1 Overview
Page
1
2
2
5
1.3.1 Pin Arrangement 9
Item
Table 1.1 Features
Table 1.1 Features
Table 1.1 Features
Figure 1.4 Bonding Pad
Location Diagram of
HCD64338024,
HCD64338023,
HCD64338022,
HCD64338021, and
HCD64338020 (Top View)
Table 1.2 Bonding Pad
Coordinates of HCD64338024,
HCD64338023,
HCD64338022,
HCD64338021, and
HCD64338020
Figure 1.5 Bonding Pad
Location Diagram of
HCD64F38024 (Top View)
Table 1.3 Bonding Pad
Coordinates of HCD64F38024
Table 1.4 Pin Functions
Figure 2.16 (1) H8/38024
Memory Map
Pad No. added
Amended
Description
Description added
Description of CPU added
Description of clock pulse
generators added
Description of product lineup
added
Added
10
11
12
1.3.2 Pin Functions
2.8.1 Memory Map
2.9.1 Notes on Data
Access
13 to 16
51
57
Amended
Figure 2.17 Data Size and
Number of States for Access to
and from On-Chip Peripheral
Modules
Figure 6.2 Socket Adapter Pin Connection of V
CC
amended
Correspondence (with
HN27C101)
Added
Table amended
6.2.2 Socket Adapter
Pin Arrangement and
Memory Map
6.5 to 6.10
6.7.1 Boot Mode
129
138 to 168
149
Table 6.8 Boot Mode
Operation
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