MSM5842RS datasheet, PDF - EEWORLD Datasheet

MSM5842RS: DescriptionMicrocontroller, 4-Bit, MROM, OLMS-40 CPU, 4MHz, CMOS, PDIP28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size378KB，8 Pages; ManufacturerLAPIS Semiconductor Co., Ltd.

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MSM5842RS Overview

Microcontroller, 4-Bit, MROM, OLMS-40 CPU, 4MHz, CMOS, PDIP28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LAPIS Semiconductor Co., Ltd.
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
Has ADC	NO
Address bus width
bit size	4
CPU series	OLMS-40
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	36.7 mm
Number of I/O lines	21
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
RAM (bytes)	16
rom(word)	768
ROM programmability	MROM
speed	4.2 MHz
Maximum slew rate	4 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

	MSM5842RS	MSM5842GS
Description	Microcontroller, 4-Bit, MROM, OLMS-40 CPU, 4MHz, CMOS, PDIP28	Microcontroller, 4-Bit, MROM, OLMS-40 CPU, 4MHz, CMOS, PDSO32
Is it Rohs certified?	incompatible	incompatible
Maker	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.
package instruction	DIP, DIP28,.6	SSOP, SOP32,.47,40
Reach Compliance Code	unknown	unknown
Has ADC	NO	NO
bit size	4	4
CPU series	OLMS-40	OLMS-40
DAC channel	NO	NO
DMA channel	NO	NO
JESD-30 code	R-PDIP-T28	R-PDSO-G32
JESD-609 code	e0	e0
Number of I/O lines	21	21
Number of terminals	28	32
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
PWM channel	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SSOP
Encapsulate equivalent code	DIP28,.6	SOP32,.47,40
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, SHRINK PITCH
Certification status	Not Qualified	Not Qualified
RAM (bytes)	16	16
rom(word)	768	768
ROM programmability	MROM	MROM
speed	4.2 MHz	4.2 MHz
Maximum slew rate	4 mA	4 mA
Maximum supply voltage	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V
surface mount	NO	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1 mm
Terminal location	DUAL	DUAL

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