xDSL CPE Line Driver
Contents
1 Revision History ............................................................................................................................. 1
1.1 Revision 3.0 ........................................................................................................................................ 1
1.2 Revision 2.0 ........................................................................................................................................ 1
1.3 Revision 1.0 ........................................................................................................................................ 1
2 Product Overview .......................................................................................................................... 2
2.1 Features .............................................................................................................................................. 2
2.2 Applications ........................................................................................................................................ 2
2.3 Block Diagram ..................................................................................................................................... 3
3 Pin Descriptions ............................................................................................................................. 4
3.1 Pin Description ................................................................................................................................... 5
4 Electrical Specifications .................................................................................................................. 6
4.1 Absolute Maximum Ratings ................................................................................................................ 6
4.1.1
4.1.2
4.1.3
Thermal Resistance ................................................................................................................................. 6
Package Assembly ................................................................................................................................... 6
Operating Ranges .................................................................................................................................... 7
4.2 Device Specifications .......................................................................................................................... 7
4.3 Operational States ............................................................................................................................ 10
4.3.1
4.3.2
4.3.3
TX States ................................................................................................................................................ 10
Power Down State ................................................................................................................................. 10
Thermal Shut-down ............................................................................................................................... 10
5 Applications ................................................................................................................................. 11
5.1 Typical Application Circuits ............................................................................................................... 11
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
IREF ........................................................................................................................................................ 12
Input Consideration ............................................................................................................................... 12
Output Driving Considerations .............................................................................................................. 12
Protection .............................................................................................................................................. 12
Power Supplies and Component Placement ......................................................................................... 12
6 Package Specifications ................................................................................................................. 13
6.1 Physical Dimension - 20-Pin Diagram ............................................................................................... 13
7 Ordering Information ................................................................................................................... 14
Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0
xDSL CPE Line Driver
1
Revision History
The revision history describes the changes that were implemented in the document. The changes are
listed by revision, starting with the most current publication.
1.1
Revision 3.0
Revision 3.0 of this document was published in August 2019. The following is a summary of the changes.
Features and applications of the Le87271 device were updated. For more information, see the
Product Overview (see page 2)
section.
Section
Output Driving Considerations (see page 12)
was edited.
1.2
1.3
Revision 2.0
Moved from Advance to Preliminary.
Revision 1.0
Revision 1.0 was published in December 2018. Revision 1.0 was the first publication of this document.
Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0
1
xDSL CPE Line Driver
2
Product Overview
The Le87271 device is a single-channel differential amplifier designed to work in Customer Premise
Equipment (CPE) systems. It provides multiple bias levels to optimize power and performance. In
addition, the line driver features a power-down state, which forces low power. The control pins respond
to input levels that can be generated with a standard GPIO.
The Le87271 device is available in a 20-pin (4 mm x 4 mm) QFN package with an exposed pad for
enhanced thermal conductivity.
2.1
Features
The Le87271 device has the following important features:
High-power differential output
Delivers line power up to 14 dBm
Operates at 14 V ±10 %
Class AB amplifiers
Four biased up states for VDSL applications
Four biased up states for ADSL applications
Power down states
Thermal shutdown circuitry
Miniature 4 mm x 4 mm thermally enhanced package
RoHS compliant
2.2
Applications
The following applications use the Le87271 device.
CPE Line Driver for ADSL, ADSL2, and ADSL2+
CPE Line Driver for VDSL2, all profiles up to 17a, 30a, and 35b.
Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0
2
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