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27C64E200/883

Description
27C64E200/883
Categorystorage    storage   
File Size793KB,12 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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27C64E200/883 Overview

27C64E200/883

27C64E200/883 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionQCCN, LCC32,.45X.55
Reach Compliance Codeunknow
Maximum access time200 ns
I/O typeCOMMON
JESD-30 codeR-XQCC-N32
JESD-609 codee0
memory density65536 bi
Memory IC TypeUVPROM
memory width8
Number of terminals32
word count8192 words
character code8000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize8KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
power supply5 V
Programming voltage13 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum standby current0.0001 A
Maximum slew rate0.02 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Base Number Matches1

27C64E200/883 Related Products

27C64E200/883 27C64E250/883 27C64E350/883 27C64Q200/883 27C64Q250/883 27C64Q350/883
Description 27C64E200/883 27C64E250/883 27C64E350/883 IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6
Reach Compliance Code unknow unknow unknow unknow unknow unknow
Maximum access time 200 ns 250 ns 350 ns 200 ns 250 ns 350 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XQCC-N32 R-XQCC-N32 R-XQCC-N32 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 65536 bi 65536 bi 65536 bi 65536 bi 65536 bi 65536 bi
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8
Number of terminals 32 32 32 28 28 28
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code QCCN QCCN QCCN DIP DIP DIP
Encapsulate equivalent code LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 DIP28,.6 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 13 V 13 V 13 V 13 V 13 V 13 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 1e-7 A 0.0001 A
Maximum slew rate 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location QUAD QUAD QUAD DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1
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