27C64E250/883 datasheet, PDF - EEWORLD Datasheet

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27C64E250/883: Description27C64E250/883; Categorystorage storage; File Size793KB，12 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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27C64E250/883 Overview

27C64E250/883

27C64E250/883 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	QCCN, LCC32,.45X.55
Reach Compliance Code	unknow
Maximum access time	250 ns
I/O type	COMMON
JESD-30 code	R-XQCC-N32
JESD-609 code	e0
memory density	65536 bi
Memory IC Type	UVPROM
memory width	8
Number of terminals	32
word count	8192 words
character code	8000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
power supply	5 V
Programming voltage	13 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.0001 A
Maximum slew rate	0.02 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

27C64E250/883 Related Products

	27C64E250/883	27C64E200/883	27C64E350/883	27C64Q200/883	27C64Q250/883	27C64Q350/883
Description	27C64E250/883	27C64E200/883	27C64E350/883	IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC	IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC	IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow
Maximum access time	250 ns	200 ns	350 ns	200 ns	250 ns	350 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XQCC-N32	R-XQCC-N32	R-XQCC-N32	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	65536 bi	65536 bi	65536 bi	65536 bi	65536 bi	65536 bi
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8
Number of terminals	32	32	32	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	QCCN	QCCN	DIP	DIP	DIP
Encapsulate equivalent code	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	13 V	13 V	13 V	13 V	13 V	13 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	1e-7 A	0.0001 A
Maximum slew rate	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1

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