Memory Circuit, 256KX4, CMOS, PDIP18, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-18
| Parameter Name | Attribute value |
| Maker | OKI |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 18 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T18 |
| length | 22.6 mm |
| memory density | 1048576 bit |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 18 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX4 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| MSM51V4223C30RS | MSM51V4223C40RS | |
|---|---|---|
| Description | Memory Circuit, 256KX4, CMOS, PDIP18, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-18 | Memory Circuit, 256KX4, CMOS, PDIP18, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-18 |
| Maker | OKI | OKI |
| Parts packaging code | DIP | DIP |
| package instruction | DIP, | DIP, |
| Contacts | 18 | 18 |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | R-PDIP-T18 | R-PDIP-T18 |
| length | 22.6 mm | 22.6 mm |
| memory density | 1048576 bit | 1048576 bit |
| Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT |
| memory width | 4 | 4 |
| Number of functions | 1 | 1 |
| Number of terminals | 18 | 18 |
| word count | 262144 words | 262144 words |
| character code | 256000 | 256000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 256KX4 | 256KX4 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm |