80200M400 datasheet, PDF - EEWORLD Datasheet

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80200M400: DescriptionRISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA241, PLASTIC, BGA-241; CategoryThe embedded processor and controller Microcontrollers and processors; File Size269KB，36 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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80200M400 Overview

RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA241, PLASTIC, BGA-241

80200M400 Parametric

Parameter Name	Attribute value
Maker	Intel
Parts packaging code	BGA
package instruction	BGA,
Contacts	241
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	16
bit size	32
boundary scan	YES
maximum clock frequency	66.66 MHz
External data bus width	64
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B241
length	23 mm
low power mode	YES
Number of terminals	241
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	2.59 mm
speed	400 MHz
Maximum supply voltage	1.365 V
Minimum supply voltage	1.235 V
Nominal supply voltage	1.3 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	23 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Intel

80200 Processor based on Intel

XScale

™

Microarchitecture

Datasheet - Commercial and Extended Temperature (80200T)

Product Features

High Performance Processor based on

Intel

XScale

™

Microarchitecture

— 7-8 stage Intel

Superpipelined

Technology

— 32-Entry Instruction Memory

Management Unit

— 32-Entry Data Memory Management

Unit

— 32 KByte, 32-way Set Associative

Instruction Cache

— 32 KByte, 32-way Set Associative Data

Cache

— 2 KByte, 2-way Set Associative

Mini-Data Cache

— 128-Entry Branch Target Buffer

— 8-Entry Write Buffer

— 4-Entry Fill and Pend Buffers

Intel

Dynamic Voltage Management

— Core Voltage Range: 0.95 V to 1.55 V

— Internal Clock Scalable by Software

— Input Clock: 33-66 MHz

ARM* Version 5TE Compliant

Application-Code Compatible with

Intel

StrongARM* SA-110

Power Management

— Core Power is ~500mW at 600MHz

— Core Voltage Operation Down to 0.95 V

— Idle and Sleep Modes

Intel

Media Processing Technology

— Multiply-Accumulate Coprocessor

High Performance External Bus

— 64- or 32-Bit Data Interface

— Optional ECC Protection

— Frequency up to 100 MHz

— Asynchronous to Processor Clock

Performance Monitoring Unit

— Two 32-Bit Event Counters

— One 32-Bit Clock Counter

— Monitors Occurrence and Duration

Events

Debug Unit

— Accessible through JTAG Port

— Hardware Breakpoints

— 256-Entry Trace Buffer

80200T can operate at an ambient

temperature range of -40C to +85C

January 2003

Reference Number: 273414-005

Intel

80200 Processor based on Intel

XScale

™

Microarchitecture

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT.

Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling

1-800-548-4725 or by visiting Intel's website at http://www.intel.com.

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TokenExpress, Trillium, Vivonic, and VTune are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and

other countries.

*Other names and brands may be claimed as the property of others.

January 2003

Datasheet - Commercial and Extended Temperature (80200T)

Intel

80200 Processor based on Intel

XScale

™

Microarchitecture

Contents

1.0

2.0

About this Document .......................................................................................................... 5

Functional Overview........................................................................................................... 5

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

2.14

3.0

3.1

Superpipeline ........................................................................................................7

Branch Target Buffer (BTB)................................................................................... 8

Instruction Memory Management Unit (IMMU) ..................................................... 8

Data Memory Management Unit (DMMU)............................................................. 9

Instruction Cache (I-Cache) .................................................................................. 9

Data Cache (D-Cache)........................................................................................10

Mini-Data Cache..................................................................................................10

Fill Buffer (FB) and Pend Buffer (PB) ..................................................................11

Write Buffer (WB) ................................................................................................11

Multiply-Accumulate Coprocessor (CP0) ............................................................11

Clock and Power Management ...........................................................................12

Performance Monitoring Unit (PMU) ...................................................................12

Debug Unit ..........................................................................................................12

Extended Temperature (80200T) ........................................................................12

Package Introduction...........................................................................................13

3.1.1 Functional Signal Definitions ..................................................................13

3.1.1.1 Signal Pin Descriptions .............................................................13

3.1.2 241 Lead PBGA Package ......................................................................17

Package Thermal Specifications .........................................................................22

Package Thermal Resistance .............................................................................22

Absolute Maximum Ratings.................................................................................24

CCA

Pin Requirements ......................................................................................25

Targeted DC Specifications.................................................................................26

Targeted AC Specifications.................................................................................27

4.4.1 Clock Signal Timings..............................................................................27

4.4.2 Bus Signal Timings.................................................................................28

4.4.3 Boundary Scan Test Signal Timings ......................................................29

AC Timing Waveforms ........................................................................................30

Power Sequence .................................................................................................32

Reset Timing .......................................................................................................34

AC Test Conditions .............................................................................................34

Typical Power Dissipation ...................................................................................35

Package Information ........................................................................................................13

3.2

3.3

4.0

4.1

4.2

4.3

4.4

Electrical Specifications....................................................................................................24

4.5

4.6

4.7

4.8

4.9

Datasheet - Commercial and Extended Temperature (80200T)

January 2003

Intel

80200 Processor based on Intel

XScale

™

Microarchitecture

Figures

Intel

80200 Processor Block Diagram ................................................................. 6

241-Lead PBGA Package ................................................................................... 17

Case Temperature with No Air Flow ................................................................... 23

Case Temperature at Nominal Power Dissipation .............................................. 23

CCA

Lowpass Filter............................................................................................ 25

CLK Waveform.................................................................................................... 30

MCLK Waveform................................................................................................. 30

Output Delay Waveform .............................................................................. 31

Correct Power Sequence for V

, V

CCP ............................................................................. 32

Another Correct Power Sequence for V

, V

CCP ............................................................32

Incorrect Power Sequence for V

, V

CCP........................................................................... 32

Preferred Power Sequence for VCC, VCCa ....................................................... 33

Correct Power Sequence for VCC, VCCa........................................................... 33

Pins’ State at Reset............................................................................................. 34

AC Test Load ...................................................................................................... 34

Typical Pin Power Dissipation............................................................................. 35

Typical Core Power Dissipation .......................................................................... 35

Tables

Related Documentation......................................................................................... 5

Pin Description Nomenclature............................................................................. 13

Signal Pin Description ......................................................................................... 14

Power Pins .......................................................................................................... 14

JTAG Pins ........................................................................................................... 16

241-Lead PBGA Pinout — Ballpad Number Order ............................................. 18

241-Lead PBGA Pinout — Signal Name Order .................................................. 20

Package Thermal Resistance — °C/Watt ........................................................... 22

Operating Conditions .......................................................................................... 24

Voltage Range Requirements for Intel

80200 Processor Product Options ....... 24

DC Characteristics .............................................................................................. 26

Characteristics .............................................................................................. 26

Input Clock Timings............................................................................................. 27

Output Timings.................................................................................................... 28

Input Timings....................................................................................................... 28

Boundary Scan Test Signal Timings ................................................................... 29

January 2003

Datasheet - Commercial and Extended Temperature (80200T)

80200M400 Related Products

	80200M400	FW80200M600T	FW80200M200	FW80200M733T	FW80200M400T	FW80200M200T	80200M733
Description	RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA241, PLASTIC, BGA-241	RISC Microprocessor, 32-Bit, 600MHz, PBGA241	RISC Microprocessor, 32-Bit, 200MHz, PBGA241	RISC Microprocessor, 32-Bit, 733MHz, PBGA241	RISC Microprocessor, 32-Bit, 400MHz, PBGA241	RISC Microprocessor, 32-Bit, 200MHz, PBGA241	RISC Microprocessor, 32-Bit, 733MHz, CMOS, PBGA241, PLASTIC, BGA-241
Maker	Intel	Intel	Intel	Intel	Intel	Intel	Intel
package instruction	BGA,	BGA, BGA241,17X17,50	BGA, BGA241,17X17,50	BGA, BGA241,17X17,50	BGA, BGA241,17X17,50	BGA, BGA241,17X17,50	BGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
bit size	32	32	32	32	32	32	32
JESD-30 code	S-PBGA-B241	S-PBGA-B241	S-PBGA-B241	S-PBGA-B241	S-PBGA-B241	S-PBGA-B241	S-PBGA-B241
Number of terminals	241	241	241	241	241	241	241
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	400 MHz	600 MHz	200 MHz	733 MHz	400 MHz	200 MHz	733 MHz
surface mount	YES	YES	YES	YES	YES	YES	YES
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	-
Is Samacsys	-	N	N	N	N	N	-
Encapsulate equivalent code	-	BGA241,17X17,50	BGA241,17X17,50	BGA241,17X17,50	BGA241,17X17,50	BGA241,17X17,50	-
power supply	-	1.3,3.3 V	1.1,3.3 V	1.5,3.3 V	1.3,3.3 V	1.1,3.3 V	-
Base Number Matches	-	1	1	1	1	1	-

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