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NM93C66EM8

Description
EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SO-8
Categorystorage    storage   
File Size101KB,10 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

NM93C66EM8 Overview

EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SO-8

NM93C66EM8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFairchild
Parts packaging codeSOIC
package instruction0.150 INCH, PLASTIC, SO-8
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Other features40 YEAR DATA RETENTION
Maximum clock frequency (fCLK)1 MHz
Data retention time - minimum40
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.9 mm
memory density4096 bit
Memory IC TypeEEPROM
memory width16
Number of functions1
Number of terminals8
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256X16
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Serial bus typeMICROWIRE
Maximum standby current0.00005 A
Maximum slew rate0.001 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Maximum write cycle time (tWC)10 ms
write protectSOFTWARE
NM93C06/C46/C56/C66 256-/1024-/2048-/4096-Bit Serial EEPROM (MICROWIRE Bus Interface)
NM93C06/C46/C56/C66
March 1997
NM93C06/C46/C56/C66
256-/1024-/2048-/4096-Bit Serial EEPROM (MICROWIRE
Bus Interface)
General Description
The NM93C06/C46/C56/C66 devices are 256/1024/2048/
4096 bits, respectively, of CMOS non-volatile electrically
erasable memory divided into 16/64/128/256 16-bit regis-
ters. They are fabricated using Fairchild Semiconductor’s
floating-gate CMOS process for high reliability and low
power consumption. These memory devices are available in
both SO and TSSOP packages for small space consider-
ations.
The EEPROM Interfacing is MICROWIRE compatible for
simple interface to standard microcontrollers and micropro-
cessors. There are 7 instructions that control these devices:
Read, Erase/Write Enable, Erase, Erase All, Write, Write All,
and Erase/Write Disable. The ready/busy status is available
on the DO pin during programming.
Features
n
Device status during programming mode
n
Typical active current of 200 µA; Typical standby current
of 10 µA
n
No erase required before write
n
Reliable CMOS floating gate technology
n
4.5V to 5.5V operation in all modes
n
MICROWIRE compatible serial I/O
n
Self-timed programming cycle
n
40 years data retention
n
Endurance: 10
6
data changes
n
Packages available: 8-pin SO, 8-pin DIP, 8-pin TSSOP
Block Diagram
DS010751-1
© 1997 Fairchild Semiconductor Corporation
DS010751
www.fairchildsemi.com
1
PrintDate=1997/08/29 PrintTime=11:28:40 10393 ds010751 Rev. No. 3 cmserv
Proof
1

NM93C66EM8 Related Products

NM93C66EM8 NM93C56M8 NM93C56MT8 NM93C56VN NM93C56VMT8 NM93C66VN NM93C66N
Description EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SO-8 EEPROM, 128X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SO-8 EEPROM, 128X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM, 128X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 128X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM, 256X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 256X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Maker Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
Parts packaging code SOIC SOIC SOIC DIP SOIC DIP DIP
package instruction 0.150 INCH, PLASTIC, SO-8 SOP, SOP8,.25 TSSOP, TSSOP8,.25 DIP, DIP8,.3 TSSOP, TSSOP8,.25 DIP, DIP8,.3 DIP, DIP8,.3
Contacts 8 8 8 8 8 8 8
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features 40 YEAR DATA RETENTION 40 YEAR DATA RETENTION 40 YEAR DATA RETENTION 40 YEAR DATA RETENTION 40 YEAR DATA RETENTION 40 YEAR DATA RETENTION 40 YEAR DATA RETENTION
Maximum clock frequency (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
Data retention time - minimum 40 40 40 40 40 40 40
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDIP-T8 R-PDIP-T8
length 4.9 mm 4.9 mm 4.4 mm 9.817 mm 4.4 mm 9.817 mm 9.817 mm
memory density 4096 bit 2048 bit 2048 bit 2048 bit 2048 bit 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
word count 256 words 128 words 128 words 128 words 128 words 256 words 256 words
character code 256 128 128 128 128 256 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 125 °C 125 °C 125 °C 70 °C
Minimum operating temperature -40 °C - - -40 °C -40 °C -40 °C -
organize 256X16 128X16 128X16 128X16 128X16 256X16 256X16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP TSSOP DIP TSSOP DIP DIP
Encapsulate equivalent code SOP8,.25 SOP8,.25 TSSOP8,.25 DIP8,.3 TSSOP8,.25 DIP8,.3 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.75 mm 1.2 mm 5.08 mm 1.2 mm 5.08 mm 5.08 mm
Serial bus type MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE
Maximum standby current 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A
Maximum slew rate 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE COMMERCIAL
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 0.65 mm 2.54 mm 0.65 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 3.9 mm 3.9 mm 3 mm 7.62 mm 3 mm 7.62 mm 7.62 mm
Maximum write cycle time (tWC) 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms
write protect SOFTWARE SOFTWARE SOFTWARE SOFTWARE SOFTWARE SOFTWARE SOFTWARE
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible - incompatible
JESD-609 code e0 e0 e0 e0 e0 - e0
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
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