DM74S572AN/A+
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP18,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 45 ns |
| JESD-30 code | R-PDIP-T18 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of terminals | 18 |
| word count | 1024 words |
| character code | 1000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX4 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DM74S572AN/A+ | DM74S572AJ/A+ | DM74S572AJ/B+ | DM74S572J/A+ | DM74S572J/B+ | DM74S572N/A+ | |
|---|---|---|---|---|---|---|
| Description | DM74S572AN/A+ | DM74S572AJ/A+ | IC,PROM,1KX4,TTL,DIP,18PIN,CERAMIC | DM74S572J/A+ | IC,PROM,1KX4,TTL,DIP,18PIN,CERAMIC | DM74S572N/A+ |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 45 ns | 45 ns | 45 ns | 60 ns | 60 ns | 60 ns |
| JESD-30 code | R-PDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-PDIP-T18 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 18 | 18 | 18 | 18 | 18 | 18 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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