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BZV55B2V0-TP

Description
Zener Diode, 2V V(Z), 2%, 0.5W, Silicon, Unidirectional, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size622KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
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BZV55B2V0-TP Overview

Zener Diode, 2V V(Z), 2%, 0.5W, Silicon, Unidirectional, MINIMELF-2

BZV55B2V0-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionMINIMELF-2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee3
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage2 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature10
Maximum voltage tolerance2%
Working test current5 mA
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla
Street Chatsworth

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BZV55C2V0
THRU
BZV55C75
500 mW
Zener Diode
2.0 to 75 Volts
MiniMELF
Features
Small surface mounting type
High reliability
Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
Absolute Maximum Ratings
Symbol
P
D
I
Z
T
J
T
STG
Rating
Power dissipation
Z-current
Junction Temperature
Storage Temperature Range
Rating
500
P
V
/V
Z
-55 to +150
-55 to +150
Unit
mW
mA
O
C
O
C
Cathode Mark
C
Maximum Thermal Resistance
Symbol
R
thJA
Rating
Junction Ambient
Rating
500
Unit
K/W
B
A
DIMENSIONS
INCHES
MIN
.134
.008
.055
MM
MIN
3.40
.20
1.40
Electrical Characteristics
Symbol
V
F
Rating
Maximum Forward Voltage
(I
F
=200mAdc)
Rating
1.5
Unit
V
DIM
A
B
C
MAX
.142
.016
.059
MAX
3.60
.40
1.50
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.105
Notes:1. Lead in Glass Exemption Applied, see EU Directive Annex 5.
0.075”
0.030”
Revision: 6
www.mccsemi.com
1 of 3
2008/01/01
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