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HY27UG084GDM-UIB

Description
Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52
Categorystorage    storage   
File Size437KB,53 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HY27UG084GDM-UIB Overview

Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52

HY27UG084GDM-UIB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeLGA
package instructionVFLGA,
Contacts52
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time30 ns
JESD-30 codeR-PBGA-B52
length17 mm
memory density4294967296 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals52
word count536870912 words
character code512000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512MX8
Package body materialPLASTIC/EPOXY
encapsulated codeVFLGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage3.3 V
Certification statusNot Qualified
Maximum seat height0.65 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBUTT
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
typeSLC NAND TYPE
width12 mm
HY27UG(08/16)4G(2/D)M Series
4Gbit (512Mx8bit / 256Mx16bit) NAND Flash
Document Title
4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Memory
Revision History
Revision
No.
0.0
Initial Draft.
1) Add Errata
tWH
tWP
25
35
tWC
50
60
History
Draft Date
May. 13. 2005
Remark
Preliminary
0.1
Specification
Relaxed value
15
20
May. 23. 2005
Preliminary
1) Correct the Valid Blocks Number.
0.2
Valid Blocks (max)
Before
After
4,098
4,096
Jun. 13. 2005
Preliminary
1) Add tRSBY (Table 11)
- tRSBY (Dummy Busy Time for Cache Read)
0.3
- tRSBY is 5us (typ.)
2) Edit Figure 18, 19
3) Correct Extended Read Status Register Commands (Table. 19)
1) Add ULGA Package.
- Figures & texts are added.
2) Correct the test Conditions (DC Characteristics table)
Test Conditions (
I
LI,
I
LO
)
Before
VIN=VOUT=0 to 3.6V
VIN=VOUT=0 to Vcc (max)
JUn. 14. 2005
Preliminary
0.4
After
Sep. 02. 2005
Preliminary
3) Change AC Conditions table
4) Add tWW parameter ( tWW = 100ns, min)
- Texts & Figures are added.
- tWW is added in AC timing characteristics table.
5) Edit System Interface Using CE don’t care Figures.
6) Correct Address Cycle Map.
Rev 0.6 / Dec. 2005
1

HY27UG084GDM-UIB Related Products

HY27UG084GDM-UIB HY27UG084GDM-UCP HY27UG084GDM-UCB HY27UG084GDM-UEB HY27UG084GDM-UIS HY27UG084GDM-UCS HY27UG084GDM-UIP HY27UG084GDM-UEP HY27UG084GDM-UES
Description Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 Flash, 512MX8, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code LGA LGA LGA LGA LGA LGA LGA LGA LGA
package instruction VFLGA, 12 X 17 MM, 0.65 MM HEIGHT, ULGA-52 VFLGA, VFLGA, VFLGA, VFLGA, VFLGA, VFLGA, VFLGA,
Contacts 52 52 52 52 52 52 52 52 52
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 30 ns 30 ns 30 ns 30 ns 30 ns 30 ns 30 ns 30 ns 30 ns
JESD-30 code R-PBGA-B52 R-PBGA-B52 R-PBGA-B52 R-PBGA-B52 R-PBGA-B52 R-PBGA-B52 R-PBGA-B52 R-PBGA-B52 R-PBGA-B52
length 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
memory density 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 52 52 52 52 52 52 52 52 52
word count 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words 536870912 words
character code 512000000 512000000 512000000 512000000 512000000 512000000 512000000 512000000 512000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - - -25 °C -40 °C - -40 °C -25 °C -25 °C
organize 512MX8 512MX8 512MX8 512MX8 512MX8 512MX8 512MX8 512MX8 512MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFLGA VFLGA VFLGA VFLGA VFLGA VFLGA VFLGA VFLGA VFLGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Programming voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL OTHER INDUSTRIAL COMMERCIAL INDUSTRIAL OTHER OTHER
Terminal form BUTT BUTT BUTT BUTT BUTT BUTT BUTT BUTT BUTT
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
type SLC NAND TYPE NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE
width 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm
Maker SK Hynix - SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
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