K8S1115EZC-DC1C0 datasheet, PDF

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K8S1115EZC-DC1C0: DescriptionFlash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-64; Categorystorage storage; File Size667KB，83 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K8S1115EZC-DC1C0 Overview

Flash, 32MX16, 100ns, PBGA64, 9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-64

K8S1115EZC-DC1C0 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	64
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	100 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 code	R-PBGA-B64
memory density	536870912 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	64
word count	33554432 words
character code	32000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Programming voltage	1.8 V
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
type	NOR TYPE

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Rev. 1.1, Sep. 2010

K8S1215ETC

K8S1215EBC

K8S1215EZC

512Mb C-die NOR FLASH

9x11, 64FBGA, 32M x16, Muxed Burst, Multi Bank SLC

1.7V ~ 1.95V

datasheet

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND

SPECIFICATIONS WITHOUT NOTICE.

Products and specifications discussed herein are for reference purposes only. All information discussed

herein is provided on an "AS IS" basis, without warranties of any kind.

This document and all information discussed herein remain the sole and exclusive property of Samsung

Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property

right is granted by one party to the other party under this document, by implication, estoppel or other-

wise.

Samsung products are not intended for use in life support, critical care, medical, safety equipment, or

similar applications where product failure could result in loss of life or personal or physical harm, or any

military or defense application, or any governmental procurement to which special terms or provisions

may apply.

For updates or additional information about Samsung products, contact your nearest Samsung office.

All brand names, trademarks and registered trademarks belong to their respective owners.

ⓒ

-1-

K8S1215E(T/B/Z)C

512Mb C-die NOR FLASH 1

datasheet

Rev. 1.1

NOR FLASH MEMORY

1.0 FEATURES................................................................................................................................................................. 5

2.0 GENERAL DESCRIPTION ......................................................................................................................................... 5

3.0 PIN DESCRIPTION .................................................................................................................................................... 5

4.0 64Ball FBGA TOP VIEW (BALL DOWN) .................................................................................................................... 6

5.0 FUNCTIONAL BLOCK DIAGRAM .............................................................................................................................. 7

6.0 ORDERING INFORMATION ...................................................................................................................................... 8

7.0 PRODUCT INTRODUCTION...................................................................................................................................... 11

8.0 COMMAND DEFINITIONS ......................................................................................................................................... 12

9.0 DEVICE OPERATION ................................................................................................................................................ 14

9.1 Read Mode .............................................................................................................................................................. 14

9.1.1 Asynchronous Read Mode................................................................................................................................ 14

9.1.2 Synchronous (Burst) Read Mode...................................................................................................................... 14

9.1.2.1 Continuous Linear Burst Read.................................................................................................................... 14

9.2 Programmable Wait State ....................................................................................................................................... 15

9.3 Handshaking............................................................................................................................................................ 15

9.4 Set Burst Mode Configuration Register ................................................................................................................... 15

9.4.1 Programmable Wait State Configuration........................................................................................................... 15

9.4.2 Burst Read Mode Setting .................................................................................................................................. 15

9.4.3 RDY Configuration ............................................................................................................................................ 16

9.5 Output Driver Setting ............................................................................................................................................... 17

9.6 Autoselect Mode...................................................................................................................................................... 17

9.7 Standby Mode ......................................................................................................................................................... 17

9.8 Automatic Sleep Mode ............................................................................................................................................ 17

9.9 Output Disable Mode ............................................................................................................................................... 17

9.10 Block Protection & Unprotection ............................................................................................................................ 18

9.11 Hardware Reset..................................................................................................................................................... 18

9.12 Software Reset ...................................................................................................................................................... 18

9.13 Program ................................................................................................................................................................. 18

9.14 Accelerated Program ............................................................................................................................................. 18

9.15 Write Buffer Programming ..................................................................................................................................... 19

9.16 Accelerated Write Buffer Programming ................................................................................................................. 19

9.17 Chip Erase ............................................................................................................................................................. 19

9.18 Block Erase ........................................................................................................................................................... 20

9.19 Blank check ........................................................................................................................................................... 20

9.20 Unlock Bypass....................................................................................................................................................... 20

9.21 Erase Suspend / Resume...................................................................................................................................... 20

9.22 Program Suspend / Resume ................................................................................................................................. 21

9.23 Read While Write Operation .................................................................................................................................. 21

9.24 OTP Block Region ................................................................................................................................................. 21

9.25 Low VCC Write Inhibit ........................................................................................................................................... 21

9.26 Write Pulse “Glitch” Protection .............................................................................................................................. 21

9.27 Logical Inhibit......................................................................................................................................................... 21

10.0 FLASH MEMORY STATUS FLAGS ......................................................................................................................... 22

11.0 Deep Power Down .................................................................................................................................................... 24

12.0 Common Flash Memory Interface............................................................................................................................. 25

13.0 ABSOLUTE MAXIMUM RATINGS ........................................................................................................................... 27

14.0 RECOMMENDED OPERATING CONDITIONS ....................................................................................................... 28

15.0 DC CHARACTERISTICS .......................................................................................................................................... 28

16.0 VCC POWER-UP...................................................................................................................................................... 29

17.0 CAPACITANCE(TA = 25 °C, VCC = 1.8V, f = 1.0MHz)............................................................................................ 29

18.0 AC TEST CONDITION.............................................................................................................................................. 30

19.0 AC CHARACTERISTICS .......................................................................................................................................... 30

19.1 Synchronous/Burst Read....................................................................................................................................... 30

19.2 Asynchronous Read .............................................................................................................................................. 34

-3-

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